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PSMN1R5-40YSD-VB Product details
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The PSMN1R5-40YSD-VB is a Single N-MOS deeply optimized for low-voltage, high-current power switching applications. Using SGT (Split Gate Trench) technology, it achieves an excellent balance between ultra-low on-resistance and fast switching capability. The LFPAK56 package offers excellent heat dissipation and current carrying characteristics while maintaining a compact footprint. The combination of 40V withstand voltage, 150A current capability, and 0.7mΩ on-resistance makes it an ideal choice for high-power applications such as server power supplies, power tools, and automotive electrical systems, especially in scenarios with stringent requirements for efficiency and thermal density.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 40V | 3V | 150A | 0.7(mΩ) | SGT |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | SGT |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 40V | 3V | 150A | SGT |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 40V | 3V | 150A | SGT |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | MOS |
VDS=40V: Suitable for 12V/24V/36V systems, providing ample voltage margin for spikes, enhancing avalanche and short-circuit robustness.
VGS=±20V: Compatible with a wide range of gate drive levels, allowing flexible use with dedicated drivers or PMICs without additional clamping circuits.
Vth=3V (typical): Moderate threshold voltage effectively suppresses dv/dt induced turn-on while ensuring full conduction under strong drive.
RDS(on)=0.7mΩ @ VGS=10V: Extremely low on-resistance, significantly reducing full-load power dissipation, allowing for smaller heatsinks or PCB copper areas.
ID=150A: Large continuous current margin, capable of handling impact loads such as motor stall, battery short-circuit protection, and power supply hot-swap.
Package LFPAK56: Low parasitic inductance, low thermal resistance, supports high-frequency PWM switching, suitable for high-density automated assembly.
Technology SGT: Charge balance structure reduces on-resistance and gate charge, optimizing the figure of merit (FOM) for both efficiency and switching speed.
Domain and module applications：
High-Power DC-DC Converters: Replaces multiple paralleled MOSFETs in synchronous rectification or point-of-load power supplies, simplifying layout and improving heavy-load efficiency.
Power Tools and Garden Machinery: High current density supports high torque output from brushless motors; low losses extend battery life per charge.
Automotive Electronics: For 12V/24V vehicle buses, suitable for driving high-power inductive loads like electric power steering, water pumps, and oil pumps.
Battery Protection and BMS: Ultra-low internal resistance reduces self-heating in the protection circuit; 150A high current capability meets the needs of energy storage battery packs and forklift batteries.
Server and Telecom Power Supplies: High thermal efficiency, suitable for VRM and OR-ing circuits, maintaining reliable operation under limited airflow conditions.
Motor Drive Modules: SGT technology reduces switching losses, allowing for higher PWM frequencies, smoother motor operation, and lower controller temperature rise.
Power Adapters and Charging Stations: Replaces traditional TO-220 packaged devices, saving space while maintaining equivalent current capability, increasing power density.
Selection Summary: With its ultra-low 0.7mΩ on-resistance, 150A high current capability, and LFPAK56 high-thermal-dissipation package, the PSMN1R5-40YSD-VB is a flagship choice for 40V low-voltage, high-power switching applications, especially suitable for projects with extreme requirements for efficiency, thermal management, and power density.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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