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BUK9Y1R3-40H-VB Product details
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BUK9Y1R3-40H-VB is a Single N-MOSFET deeply optimized for low-voltage high-current power switching applications. It uses advanced SGT (Split Gate Trench) technology to achieve an excellent balance between ultra-low on-resistance and switching speed. The LFPAK56 package combines excellent heat dissipation capability with a compact footprint. The combination of 40V withstand voltage, 150A current capability, and 0.7mΩ on-resistance makes it an ideal core power device for applications such as server power supplies, automotive electrical systems, and high-power density DC-DC converters.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 40V | 3V | 150A | 0.7(mΩ) | SGT |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | SGT |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 40V | 3V | 150A | SGT |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 40V | 3V | 150A | SGT |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | MOS |
VDS=40V: Covers 12V/24V/36V systems, provides ample voltage spike margin, enhancing system avalanche and surge immunity.
VGS=±20V: Compatible with various gate drive levels, supporting 4.5V~12V drive, flexibly adapting to controllers and driver ICs.
Vth=3V (typical): Moderate threshold voltage, balancing anti-interference capability and full conduction capability, suitable for strong interference industrial environments.
RDS(on)=0.7mΩ @ VGS=10V: Extremely low on-resistance, significantly reduces conduction loss, can significantly reduce heatsink size or copper area.
ID=150A: Huge continuous current capability, meeting high-power load startup and transient peak requirements, with ample margin.
Package LFPAK56: Low parasitic inductance, low thermal resistance, supports high-frequency high-current switching, saves PCB space and improves reliability.
Domain and module applications：
High-Power DC-DC Converters: Ultra-low on-resistance significantly improves synchronous rectification efficiency, reducing loss by 2-3% under heavy load, helping module miniaturization.
Automotive 12V/24V Electrical Systems: 40V withstand voltage handles vehicle bus load dump transients, 150A high current supports high-power loads like starters and electric power steering.
Motor Drives and BLDC Controllers: SGT technology provides excellent switching characteristics, low PWM loss, smooth motor operation, significantly reduced controller temperature rise.
Server and Communication Power Supplies: Under low-voltage high-current architecture, 0.7mΩ RDS(on) is one of the best choices for the rectification stage, improving overall power density.
Battery Protection and BMS: Microsecond-level fast turn-off capability combined with extremely low internal resistance effectively reduces protection board heat generation, extending battery pack life.
Power Tools and Industrial Equipment: LFPAK56 package is vibration resistant, has strong heat dissipation, adapts to high overload and high impact working environments, with high reliability.
Load Switches and Power Distribution Systems: 150A continuous current supports high-power circuit switching, wide SOA simplifies thermal design.
Selection Summary: BUK9Y1R3-40H-VB, with its SGT technology, 0.7mΩ ultra-low on-resistance, 150A high current capability, and LFPAK56 low thermal resistance package, becomes a high-performance benchmark in the 40V low-voltage high-current switching field, especially suitable for projects with extreme requirements for efficiency, power density, and reliability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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