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AP9569GM-VB Product details
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AP9569GM-VB is a Single P-MOS deeply optimized for low-voltage power switching scenarios. The Trench technology balances low switching losses and high reliability. The SOP8 package achieves a good balance between heat dissipation capability and board area. The combination of 40V withstand voltage, 16.1A current carrying capability, and 10mΩ on-resistance makes it an ideal cost-reducing and capacity-increasing alternative to traditional DPAK or larger packages, especially suitable for medium-to-high power, high-density applications.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| SOP8 | Single-P | -40V | -2V | -16.1A | 14(mΩ) | 10(mΩ) | Trench |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| SOP8 | Single-P | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| SOP8 | Single-P | -40V | -2V | -16.1A | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| SOP8 | Single-P | -40V | -2V | -16.1A | Trench |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| SOP8 | Single-P | MOS |
VDS=-40V: Suitable for 12V/24V systems, providing sufficient margin for negative voltage spikes, reducing the risk of avalanche breakdown, and improving system robustness.
VGS=±20V: Compatible with a wide range of gate drive voltages, can be directly connected to controllers or driver ICs, simplifying peripheral circuit design.
Vth=-2V (Typical): Clear gate drive logic, combined with negative voltage switching scenarios, allows for rapid entry into the fully conductive region.
RDS(on)=10mΩ @ VGS=10V: Ultra-low on-resistance, significantly reduces temperature rise under full load, can reduce the area of heat dissipation copper foil.
RDS(on)=14mΩ @ VGS=4.5V: Maintains low on-impedance even under low-voltage drive, suitable for 5V logic drive scenarios.
ID=-16.1A: Ample continuous current margin, can handle the peak demands of most power loads, suitable for load switches and power path management.
Package SOP8: Standard SMD package, heat dissipation performance better than smaller packages, while balancing PCB layout flexibility and mass production yield.
Domain and module applications：
Power Reverse Polarity Protection: P-MOS high-side switch architecture is naturally suitable for reverse polarity protection, low on-resistance reduces system voltage drop and power consumption.
Battery Management Module: Low losses in negative voltage switching paths, low temperature rise in charge/discharge loops, improving battery system efficiency and safety.
DC-DC Converters: Replaces diodes in synchronous rectification or load switches, significantly improves heavy-load efficiency, facilitates module miniaturization.
Motor Drive Control: Low PWM switching losses, smoother motor operation, significantly lower controller temperature rise, suitable for low-voltage motors below 24V.
Power Tools and Industrial Control: 40V withstand voltage and 16.1A current margin meet high surge load requirements, high reliability.
Automotive Auxiliary Circuits: Wide operating temperature range and low-voltage logic compatibility, suitable for 12V/24V automotive bus scenarios.
Load Switch and Power Distribution: Single P-MOS simplifies high-side switch design, reduces component count, improves system integration.
Selection Summary: AP9569GM-VB achieves a balance between power density, conduction losses, and package compatibility. It is a cost-effective general-purpose choice for 40V negative voltage switching applications, especially suitable for projects with strict requirements on voltage drop, heat dissipation, and system cost.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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