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FDU3706-VB Product details

Product introduction:

The FDU3706-VB is a Single N-MOSFET deeply optimized for low-voltage high-current power switching applications. The Trench technology balances ultra-low on-resistance with fast switching capability, and the TO251 package achieves a good balance between thermal performance and ease of installation. The combination of 30V withstand voltage, 50A continuous current capability, and 7mΩ-level on-resistance makes it an ideal choice for high-power-density power conversion, motor drive, and battery protection applications, especially suitable for system designs with stringent requirements on conduction losses and temperature rise.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
TO251 Single-N 30V 1.7V 50A 9(mΩ) 7(mΩ) Trench
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
TO251 Single-N Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
TO251 Single-N 30V 1.7V 50A Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
TO251 Single-N 30V 1.7V 50A Trench
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
TO251 Single-N MOS

VDS=30V: Suitable for 5V/12V/24V low-voltage systems, providing sufficient voltage margin for switching spikes, enhancing system reliability.
VGS=±20V: Compatible with 1.8V~12V logic levels, can be directly connected to MCU/PMIC or driver outputs, simplifying gate drive circuitry.
Vth=1.7V (typical): Lower threshold voltage ensures full conduction during low-voltage drive, maintaining stable operation even under battery voltage sag scenarios.
RDS(on)=7mΩ @ VGS=10V: Ultra-low on-resistance, effectively reducing full-load losses and temperature rise, allowing for smaller heatsink or copper area.
RDS(on)=9mΩ @ VGS=4.5V: Still exhibits excellent conduction characteristics under lower gate voltage drive, suitable for direct 5V logic drive.
ID=50A: Ample continuous current capability to meet peak and sustained current demands of high-power loads, providing sufficient margin.
Package TO251: Through-hole package facilitates heat dissipation and soldering, offering good thermal resistance characteristics and mechanical strength, suitable for power stage circuit layout.

Domain and module applications:


Low-Voltage High-Current DC-DC Converters: Replaces Schottky diodes in synchronous rectification applications, significantly improving heavy-load efficiency and reducing output ripple.
Power Tools and Low-Voltage Motor Drives: Extremely low on-resistance reduces PWM switching losses, resulting in smoother motor operation and lower controller temperature rise.
Battery Protection and BMS Modules: Fast switching response and low internal resistance ensure reliable protection during overcurrent/short circuit events, reducing self-heating of the protection board.
Automotive Auxiliary Power Supplies and 12V Systems: Ample voltage margin combined with a wide operating temperature range adapts to the stringent reliability requirements of automotive electronics.
Server Power Supplies and Communication Power Supplies: High current carrying capability combined with efficient heat dissipation package meets the continuous output demands of high-power-density modules.
Electric Forklift/AGV Drive Control: 50A high current capability handles frequent start/stop and heavy-load conditions, improving overall system energy efficiency.
Power Inverters and UPS: The low conduction losses of Trench technology improve inverter efficiency, and the TO251 package facilitates layout and high-current trace routing.

Selection Summary: The FDU3706-VB achieves an excellent balance between ultra-low on-resistance, high current carrying capability, and package thermal performance. It is a high cost-performance preferred solution for 30V low-voltage high-current switching applications, particularly suitable for power system designs with clear requirements for efficiency, temperature rise, and reliability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

Technical support:

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