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FDD86102-VB Product details
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The FDD86102-VB is a Single N-MOSFET deeply optimized for medium-voltage power switching applications. It utilizes SGT (Split Gate Trench) technology, balancing low conduction losses with excellent switching characteristics. The TO252 package achieves a good balance between heat dissipation capability and soldering process convenience. The combination of 100V withstand voltage, 35A current carrying capacity, and 15mΩ on-resistance makes it a reliable replacement for traditional DPAK devices in communication power supplies, industrial control, and automotive systems, especially suitable for applications with stringent requirements for temperature rise and current margin.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| TO252 | Single-N | 100V | 1.8V | 35A | 21(mΩ) | 15(mΩ) | SGT |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| TO252 | Single-N | SGT |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| TO252 | Single-N | 100V | 1.8V | 35A | SGT |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| TO252 | Single-N | 100V | 1.8V | 35A | SGT |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| TO252 | Single-N | MOS |
VDS=100V: Suitable for 24V/48V/60V systems, provides ample margin for voltage spikes, significantly reducing the risk of avalanche breakdown.
VGS=±20V: Compatible with 5V~12V logic levels, can be directly connected to MCU/PMIC, simplifying drive circuit design.
Vth=1.8V (typical): Can enter the fully enhanced region even with low-voltage drive, adapting to a wide range of gate drive conditions.
RDS(on)=15mΩ @ VGS=10V: Ultra-low on-resistance, significantly reduces temperature rise under full load, can reduce heatsink size or copper area.
RDS(on)=21mΩ @ VGS=4.5V: Maintains low on-resistance even with low-voltage gate drive, supporting direct drive from 5V logic.
ID=35A: Ample continuous current margin, capable of handling peak current surges from motor starting, capacitor charging, etc.
Package TO252: The thermal pad design facilitates heat conduction, suitable for medium to high power PCB layouts, balancing size and manufacturability.
Domain and module applications：
DC-DC Converters: Replaces Schottky diodes in synchronous rectification, can improve heavy-load efficiency by 2-3%, facilitating module miniaturization.
Battery Protection and Charge/Discharge Management: Fast switching characteristics ensure timely shutdown during overcurrent/short circuit, low internal resistance reduces self-heating of the protection board.
Low-Voltage Motor Drives: Low PWM switching losses, smoother motor operation, significantly lower controller temperature rise.
Communication Equipment Power Supplies: 100V withstand voltage adapts to wide input range, SGT technology enhances avalanche ruggedness, increasing system reliability.
Industrial Control Modules: High current margin meets the driving requirements of inductive loads like solenoids and relays, voltage margin handles spikes.
Automotive Auxiliary Power Supplies: Voltage margin and wide operating temperature range adapt to 24V automotive bus, high reliability.
LED Lighting Drivers: Low conduction voltage drop reduces constant current source power consumption, supports multi-channel parallel connection, improving overall luminaire efficacy.
Selection Summary: The FDD86102-VB achieves a balance between withstand voltage, on-resistance, current carrying capacity, and package heat dissipation. It is a cost-effective general-purpose choice for 100V medium-power switching applications, particularly suitable for projects with strict requirements on heat dissipation, reliability, and current margin.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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