NTHL070N120M3S-VB Product details
Product introduction:
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Product parameter:
| VB Package | Configuration | VDS(V) | VGS | Vthyp(V) | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| TO247 | Single-N | 1200V | 2~4 | 30A | SiC-S |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| TO247 | Single-N | SiC-S |
| VB Package | Configuration | VDS(V) | VGS | Vthyp(V) | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| TO247 | Single-N | 1200V | 2~4 | 30A | 80(mΩ) | SiC-S |
| VB Package | Configuration | VDS(V) | VGS | Vthyp(V) | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| TO247 | Single-N | 1200V | 2~4 | 30A | SiC-S |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| TO247 | Single-N | SIC |
- **VDS=1200V**: Covers three-phase grid, 800V bus, and photovoltaic string voltage levels, providing ample voltage margin for spikes, reducing avalanche breakdown risk, and enhancing system robustness.
- **VGS=-10V**: Supports negative voltage turn-off, enhancing dv/dt immunity and effectively suppressing bridge arm crosstalk; recommends +18V forward drive for conduction, fully compatible with mainstream SiC gate drivers.
- **Vth=2~4V**: Reasonable threshold voltage window, balancing noise immunity and fast turn-on, compatible with standard 18V/20V drive levels.
- **RDS(on)=80mΩ @ VGS=18V**: Naturally low resistance characteristic of SiC material, drastically reducing full-load conduction losses, reducing power consumption by approximately 80% compared to equivalent Si-based devices, simplifying thermal design.
- **ID=30A**: Ample continuous current capability, combined with the low thermal resistance TO247 package, stably handles high-voltage, high-current conditions, meeting peak power demands.
- **Package TO247**: Industry standard high-power package, reliable soldering, large thermal capacity, suitable for long-lead PCB or bolt mounting, supports high voltage isolation.
- **Technology SiC-S**: Third-generation SiC process, extremely low gate charge (Qg) and zero reverse recovery charge, switching frequency can exceed 100kHz, significantly reducing the size of magnetic components.
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Domain and module applications:
- **Photovoltaic Inverters**: High-voltage SiC devices reduce DC-AC conversion losses, improve grid-tie efficiency, and help break through the power density limits of string inverters.
- **Energy Storage Converters (PCS)**: Achieve efficient energy conversion in bidirectional DC-DC and DC-AC topologies, with voltage margin ensuring safety on both battery and grid sides.
- **Onboard Chargers (OBC)**: 1200V withstand voltage directly adapts to 800V high-voltage platforms, reducing series voltage balancing circuits, speeding up charging, and reducing vehicle weight.
- **Wind Power Converters**: High current and low loss characteristics improve efficiency across the full power range, enhancing long-term reliability in harsh outdoor environments.
- **Industrial Motor Drives**: SiC's low switching losses support high-frequency PWM, reducing motor iron losses and torque ripple, with significantly improved temperature control.
- **High-Voltage DC-DC Converters**: Replaces silicon-based IGBTs/diodes in synchronous rectification, improving heavy-load efficiency by 2-4%, aiding in the miniaturization of server power supplies and charging stations.
- **Smart Grid and Solid-State Transformers**: Fast switching and high-temperature operation capabilities adapt to high-voltage, high-power energy routing, improving grid dynamic response speed.
**Selection Summary**
The NTHL070N120M3S-VB achieves an ultra-low on-resistance of 80mΩ and a high current capability of 30A on a 1200V high-voltage platform, combined with SiC's extremely fast switching and zero reverse recovery characteristics. It is a superior advanced alternative to traditional silicon-based IGBTs. The TO247 package balances heat dissipation and ease of installation, making it particularly suitable for power electronics projects with extreme requirements for efficiency, power density, and high-temperature reliability, helping engineers quickly implement high-performance solutions while balancing stringent cost and performance targets.
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