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FCH170N60-VB Product details

Product introduction:

FCH170N60-VB is a Single N-MOS deeply optimized for high-voltage power switching scenarios. It uses SJ_Multi-EPI (Super Junction Multi-Epitaxial) technology to achieve an excellent balance between low on-resistance and low switching losses at a 600V voltage rating. The TO247 package offers excellent heat dissipation and creepage distance, making it suitable for high-power, high-reliability industrial and energy system applications. The combination of 25A continuous current-carrying capacity and 120mΩ on-resistance makes it a cost-effective alternative to traditional planar MOSFETs in topologies such as high-voltage rectification, inversion, and PFC, especially suitable for projects with strict requirements on temperature rise and efficiency.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
TO247 Single-N 600V 3.5V 25A 110(mΩ) SJ_Multi-EPI
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
TO247 Single-N SJ_Multi-EPI
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
TO247 Single-N 600V 3.5V 25A SJ_Multi-EPI
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
TO247 Single-N 600V 3.5V 25A SJ_Multi-EPI
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
TO247 Single-N

VDS=600V: Suitable for three-phase 380V input, high-voltage DC-DC, and photovoltaic systems, providing ample voltage spike margin and enhancing system avalanche capability.
VGS=±30V: Wide gate drive window, compatible with various drive ICs, reducing false turn-on risk and improving drive circuit design flexibility.
Vth=3.5V (Typical): Moderate threshold voltage, balancing noise immunity and drive compatibility, suitable for standard 12~15V gate drive.
RDS(on)=120mΩ @ VGS=10V: Superjunction multi-epitaxial technology significantly reduces on-resistance per unit area, minimizing full-load losses and allowing for smaller heatsink selection.
ID=25A: Ample continuous current margin, combined with TO247 package, stably handles high-voltage, high-power pulsed loads.
Package TO247: Through-hole mounting, low thermal resistance, suitable for long-term full-load operation, facilitating insulation and thermal design, enhancing long-term system reliability.

Domain and module applications:


Switching Power Supply PFC Circuit: Low conduction loss and high voltage withstand improve Power Factor Correction efficiency, reducing magnetic component size.
High-Voltage DC-DC Converter: Suitable for industrial bus power supplies and server power supplies, leveraging low loss advantages in both hard-switching and soft-switching topologies.
Photovoltaic Inverter: Can withstand high bus voltage in the MPPT boost stage and inverter bridge arm, the multi-epitaxial process enhances avalanche ruggedness, improving system lifespan.
Motor Driver: 600V voltage withstand covers the bus voltage after three-phase mains rectification, the TO247 package facilitates heat dissipation design for high-power frequency converters.
UPS Uninterruptible Power Supply: Provides stable switching performance in the rectifier/inverter dual conversion chain, controllable full-load temperature rise, ensuring power supply to critical loads.
Charging Pile Power Module: Applied in high-frequency LLC or phase-shifted full bridge, low RDS(on) effectively improves module conversion efficiency, reducing overall system thermal management costs.
Industrial High-Voltage Auxiliary Power Supply: Wide Safe Operating Area (SOA) and strong surge withstand capability adapt to harsh grid environments, reducing failure risks caused by voltage spikes.

Selection Summary: FCH170N60-VB achieves an excellent balance between high voltage withstand, low on-resistance, and package heat dissipation capability. Leveraging SJ_Multi-EPI technology, it provides an efficient and reliable switching solution for 600V power conversion applications, making it a universal preferred device for industrial-grade high-voltage power supplies and energy equipment.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

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