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SPW20N60C3E8177FKSA1-VB Product details

Product introduction:

The SPW20N60C3E8177FKSA1-VB is a Single N-MOSFET deeply optimized for high-voltage power switching scenarios. Using SJ_Multi-EPI (super-junction multi-epitaxial) technology, it balances low conduction losses with high reliability, and the TO247 package provides excellent heat dissipation and creepage distance. The combination of 650V withstand voltage, 20A current carrying capacity, and 160mΩ on-resistance makes it a preferred device for medium-to-high-power applications such as server power supplies, photovoltaic inverters, and industrial drives, especially suitable for systems with stringent requirements on voltage withstand and thermal performance.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
TO247 Single-N 650V 3.5V 20A 160(mΩ) SJ_Multi-EPI
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
TO247 Single-N SJ_Multi-EPI
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
TO247 Single-N 650V 3.5V 20A SJ_Multi-EPI
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
TO247 Single-N 650V 3.5V 20A SJ_Multi-EPI
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
TO247 Single-N


VDS=650V: Suitable for three-phase 380V rectification, photovoltaic bus, and high-voltage DC-DC systems, providing ample voltage spike margin, significantly reducing avalanche breakdown risk.

VGS=±30V: Large gate drive margin, compatible with common PWM controllers and driver ICs, strong anti-interference capability, simplifies drive circuit design.

Vth=3.5V (typical): Moderate threshold voltage, effectively suppresses false turn-on caused by Miller effect, enhances system noise immunity, suitable for industrial-grade drive environments.

RDS(on)=160mΩ @ VGS=10V: Superjunction structure achieves low on-resistance, significantly reduces full-load losses, combined with TO247 package for effective temperature control.

ID=20A: Ample continuous current capability, covering 1kW~3kW level switching power supplies and motor drive applications, strong instantaneous overload capability.

Package TO247: Through-hole mounting, low thermal resistance, large heat dissipation area, suitable for power stage designs requiring bottom insulation or large copper area heat dissipation, high long-term reliability.

Domain and module applications:


Switching Power Supplies: Low conduction losses under high-voltage bus input, improves AC-DC conversion efficiency, suitable for PFC and LLC stages of server and telecom power supplies.

Photovoltaic Inverters: 650V voltage tolerance combined with low on-resistance, reduces DC-AC conversion losses, improves overall power generation efficiency, adapts to wide input voltage range.

Industrial Motor Drives: Superjunction technology provides fast switching characteristics, reduces PWM switching losses, significantly lowers driver temperature rise, suitable for inverters and servo systems.

High-Voltage DC-DC Converters: Replaces traditional high-voltage MOSFETs in synchronous rectification or hard-switching topologies, significantly improves efficiency under heavy load, beneficial for increasing module power density.

UPS Uninterruptible Power Supplies: Large voltage margin can handle battery voltage fluctuations and surge impacts, ensuring stable power supply for critical loads, improving system reliability.

Electric Vehicle Charging Piles: Under high-voltage high-current operating conditions, low losses and strong heat dissipation ensure stability during long-term full-load operation, reducing heat sink system costs.

Selection Summary: SPW20N60C3E8177FKSA1-VB achieves a balance between high voltage tolerance, low on-resistance, package heat dissipation, and system reliability. It is a cost-effective general-purpose choice for 650V high-voltage switching applications, especially suitable for industrial and energy projects with strict requirements for power density and long-term reliability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

Technical support:

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