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MCB075N60SH-TP-VB Product details
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MCB075N60SH-TP-VB is a Single N-MOS deeply optimized for high-voltage power switching scenarios, adopting SJ_Multi-EPI super junction technology, achieving an excellent balance between on-resistance and switching speed. The TO263 package combines heat dissipation capability with mounting reliability. The combination of 600V withstand voltage, 25A current carrying capacity, and 120mΩ on-resistance makes it a preferred device for medium-to-high-power applications such as high-voltage power supplies, inverters, and industrial drives, especially suitable for systems with strict requirements on efficiency and thermal stability.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| TO263 | Single-N | 600V | 3.5V | 25A | 110(mΩ) | SJ_Multi-EPI |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| TO263 | Single-N | SJ_Multi-EPI |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| TO263 | Single-N | 600V | 3.5V | 25A | SJ_Multi-EPI |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| TO263 | Single-N | 600V | 3.5V | 25A | SJ_Multi-EPI |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| TO263 | Single-N |
VDS=600V: Covers bus voltage after 220V/380V AC rectification and various high-voltage systems, providing ample peak voltage margin to enhance avalanche ruggedness.
VGS=±30V: Large gate drive margin, compatible with various driver ICs and logic levels, reducing false triggering risk, enhancing system robustness.
Vth=3.5V (Typical): Moderate threshold voltage, strong noise immunity, ensures reliable turn-on and turn-off in high-voltage applications.
RDS(on)=120mΩ @ VGS=10V: Low on-resistance achieved by superjunction technology, significantly reducing full-load losses, beneficial for improving power conversion efficiency.
ID=25A: Ample continuous current margin, capable of handling transient overcurrent surges such as motor startup and capacitive loads, enhancing system reliability.
Package TO263: Low conduction thermal resistance, short heat dissipation path, suitable for high power density design, compatible with standard SMT processes, easy for mass production.
Domain and module applications：
Switching Power Supply (SMPS): Ultra-low conduction loss and high voltage withstand capability, suitable for LLC half-bridge, active PFC, and flyback main switches.
Industrial Inverters and Drives: 600V withstand voltage combined with low thermal resistance package, meeting high-frequency PWM requirements for motor drives, reducing temperature rise and extending lifespan.
Photovoltaic Inverters: Efficient DC-AC conversion, low conduction loss improves overall system power generation efficiency, suitable for string and micro-inverter topologies.
Electric Vehicle Chargers and Onboard Power Supplies: High voltage margin to handle battery bus fluctuations, 25A current capability covers mainstream charging power levels.
UPS Uninterruptible Power Supplies: Fast switching and low loss characteristics ensure efficient and stable operation during mains/battery switching, reducing heat accumulation.
High Voltage DC-DC Converters: Superjunction structure reduces losses in high-voltage step-down/step-up applications, suitable for communication base stations, server power supplies, etc.
Power Factor Correction (PFC): 120mΩ on-resistance reduces rectification losses, improves power factor, meeting energy efficiency certification requirements. Selection Summary: MCB075N60SH-TP-VB achieves a balance between high voltage withstand, current carrying capacity, and package heat dissipation, making it a cost-effective general-purpose choice for 600V-level switching applications, especially suitable for industrial and energy projects with strict requirements on efficiency, thermal reliability, and system cost.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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