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BUK761R8-30C,118-VB Product details
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The BUK761R8-30C,118-VB is a Single N-MOS deeply optimized for low-voltage, high-current power switching scenarios. The Trench technology balances ultra-low conduction losses with high switching speed, and the TO263 package achieves an ideal balance between heat dissipation capability and soldering reliability. The combination of 30V voltage tolerance, 260A continuous current, and an ultra-low on-resistance of 1.4mΩ makes it a high-performance core device in low-voltage, high-power power supplies, motor drives, and battery protection applications, especially suitable for systems with strict requirements on current capacity and temperature rise control.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| TO263 | Single-N | 30V | 1.7V | 260A | 1.6(mΩ) | 1.4(mΩ) | Trench |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| TO263 | Single-N | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| TO263 | Single-N | 30V | 1.7V | 260A | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| TO263 | Single-N | 30V | 1.7V | 260A | Trench |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| TO263 | Single-N |
VDS=30V: Adapts to 5V/12V/24V low-voltage systems, reserves sufficient voltage margin for switching spikes, reduces avalanche breakdown risk.
VGS=±20V: Compatible with 4.5V~12V logic level drives, flexibly adaptable to MCU, PMIC, or dedicated gate driver ICs.
Vth=1.7V (typical): Good turn-on characteristics under low-voltage drive, enters low on-state with 4.5V drive.
RDS(on)=1.4mΩ @ VGS=10V (1.6mΩ @ VGS=4.5V): Extremely low on-resistance, minimal conduction loss at full load, significantly reduces device temperature rise, simplifies thermal design.
ID=260A: Large continuous current margin, strong ability to handle peak current surges, suitable for high-power density converters and high-current switching loops.
Package TO263: Excellent thermal and current-carrying capability, suitable for direct PCB mounting, facilitates efficient heat dissipation, supports automated production.
Domain and module applications：
Low-Voltage High-Power DC-DC Converters: Ultra-low on-resistance effectively improves heavy-load efficiency, especially suitable for synchronous rectification BUCK circuits and server power modules.
Battery Protection & BMS: Milliohm-level internal resistance significantly reduces self-heating of the protection board. 260A current capability meets the high-current switching needs of power battery packs and energy storage systems.
Automotive Low-Voltage Power Switches: 30V voltage rating is suitable for 12V/24V vehicle buses. TO263 package adapts to high-vibration, wide-temperature conditions, supporting body control and auxiliary power modules.
Motor Drives & Power Tools: Extremely low RDS(on) reduces PWM output loss. High current capability ensures reliable operation during stall and startup surges.
Industrial Power Supplies & UPS: High efficiency and low thermal characteristics reduce heatsink size, aiding in the miniaturization and long-life design of power modules.
High-Current Load Switches: Suitable for power distribution circuits in servers and communication equipment requiring high-current switching, achieving low loss and fast shutdown. Selection Summary: The BUK761R8-30C,118-VB achieves extremely low on-resistance and high current capability at the 30V voltage level. Combined with the excellent thermal performance of the TO263 package, it is a high-performance, preferred solution for high power density low-voltage switching applications, especially suitable for projects with stringent requirements for conduction loss, current margin, and system reliability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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