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NTMYS2D2N06CLTWG-VB Product details

Product introduction:

NTMYS2D2N06CLTWG-VB is a Single N-MOS deeply optimized for low-voltage high-current power switching scenarios. It adopts SGT (Split Gate Trench) technology, balancing ultra-low on-resistance with excellent switching performance. The LFPAK56 package achieves an excellent balance between heat dissipation capability and board space. The combination of 60V withstand voltage, 270A current carrying capacity, and 1.2mΩ on-resistance makes it an ideal choice for high power density applications such as server power supplies, power tools, and automotive electronics, especially suitable for replacing traditional DPAK or D2PAK packages to significantly improve system efficiency and reliability.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
LFPAK56 Single-N 60V 2V 270A 1.2(mΩ) SGT
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
LFPAK56 Single-N SGT
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
LFPAK56 Single-N 60V 2V 270A SGT
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
LFPAK56 Single-N 60V 2V 270A SGT
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
LFPAK56 Single-N

VDS=60V: Suitable for 12V/24V/48V systems, provides ample spike voltage margin, effectively resists avalanche breakdown, enhances system robustness.
VGS=±20V: Compatible with 5V~12V logic levels, can be directly connected to MCU/drivers, simplifying gate drive circuit design.
Vth=2V (Typical): Moderate threshold voltage, strong anti-interference capability, while ensuring full conduction under low-voltage drive, suitable for various drive schemes.
RDS(on)=1.2mΩ @ VGS=10V: Ultra-low on-resistance, minimal conduction loss at full load, significantly reduces temperature rise, allowing for smaller heatsink size or copper area.
ID=270A: Extremely ample continuous current capability, can handle high transient current scenarios such as high-power motor startup and battery short-circuit protection.
Package LFPAK56: Optimized bottom-side cooling structure, low thermal resistance, low parasitic inductance, supports high-frequency switching, while saving PCB area and increasing power density.

Domain and module applications:


Server and data center power supplies: Ultra-low on-resistance improves synchronous rectification efficiency, 270A high current capability meets high-power VRM and OR-ing circuit requirements.
Power tools and garden machinery: High current margin handles stall impacts, SGT process reduces switching losses, extending battery life.
Automotive electronics and onboard power supplies: 60V withstand voltage adapts to 12V/24V vehicle buses, wide operating temperature range (-55~150°C) ensures reliability in harsh environments.
High-power DC-DC converters: Replaces multiple parallel low-voltage MOSFETs, simplifies circuit design, improves heavy-load efficiency by 2-3%, facilitating module miniaturization.
Battery protection and BMS: Milliohm-level on-resistance reduces self-heating of the protection board, fast turn-off characteristic ensures microsecond-level response during overcurrent/short circuit.
Low voltage high current motor drives: Extremely low PWM losses, smoother motor operation, significantly reduced controller temperature rise, suitable for drones, robots, and other scenarios.
Electric forklifts and AGVs: 270A current carrying capacity covers high-power traction needs, LFPAK56 package ensures reliable connection under high vibration environments. Selection Summary: NTMYS2D2N06CLTWG-VB achieves an extreme balance between withstand voltage, current carrying capacity, on-resistance, and package thermal performance. It is a high-performance general-purpose choice for 60V low-voltage high-current switching applications, especially suitable for projects with strict requirements on efficiency, power density, and long-term reliability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

Technical support:

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