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PSMNR98-25YLEX-VB Product details

Product introduction:

The PSMNR98-25YLEX-VB is a Single N-MOSFET deeply optimized for low-voltage, high-power switching applications. Using advanced SGT (Shielded Gate Trench) technology, it achieves an excellent balance between ultra-low on-resistance and high switching speed. The LFPAK56 package offers superior heat dissipation and low parasitic inductance, making it suitable for high-density current conversion and compact power system designs. The combination of 40V withstand voltage, 150A continuous current capability, and 0.7mΩ ultra-low on-resistance makes it an ideal upgrade option to replace traditional DPAK/D2PAK packages in low-voltage, high-current applications, especially for server power supplies, automotive electrical systems, and high-performance DC-DC modules.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
LFPAK56 Single-N 40V 3V 150A 0.7(mΩ) SGT
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
LFPAK56 Single-N SGT
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
LFPAK56 Single-N 40V 3V 150A SGT
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
LFPAK56 Single-N 40V 3V 150A SGT
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
LFPAK56 Single-N

VDS=40V: Suitable for 12V/24V/36V systems, with ample margin for switching voltage spikes, enhanced avalanche ruggedness, reducing system failure risk.
VGS=±20V: Compatible with standard gate drives and various PWM controllers, can be driven directly by driver ICs or logic circuits, simplifying peripheral design.
Vth=3V (typical): Moderate threshold voltage, effectively suppresses Miller plateau false turn-on, improves current sharing stability in multi-device parallel configurations.
RDS(on)=0.7mΩ @ VGS=10V: Ultra-low on-resistance, minimal full-load losses, significantly reduces temperature rise, enabling smaller heatsinks or higher power density.
ID=150A: Strong continuous current capability, confidently handles high-surge current scenarios like motor startup, battery short-circuit protection, and energy storage systems.
Package LFPAK56: Low thermal resistance, low parasitic inductance, supports high-frequency switching, saves PCB space, facilitating high-current trace layout.
Technology SGT: Shielded gate structure reduces Qgd/Qgs ratio, better EMI performance, lower switching losses, suitable for both hard-switching and soft-switching topologies.

Domain and module applications:


High-power DC-DC Converter: Replaces multiple parallel low-voltage MOSFETs in synchronous rectification applications; 0.7mΩ resistance significantly improves heavy-load efficiency, allowing further module size reduction.
Server and Telecom Power Supplies: Handles rectification or half-bridge switching in 48V/12V bus conversion; low loss and high thermal reliability meet long-term full-load operation requirements.
Automotive Electrical Systems: 40V withstand voltage covers 12V/24V vehicle bus transient overvoltage; 150A current capability supports main fuse bypass, electronic fuses, and high-power load switches.
Motor Drive and Control: Low on-resistance and high current output reduce winding drive losses; smooth PWM switching characteristics suit power tools, small electric vehicles, and drone ESCs.
Battery Protection and BMS: High current carrying capacity combined with low conduction voltage drop reduces protection board heat generation; suitable for high-rate charge/discharge scenarios like energy storage battery packs and portable power supplies.
UPS and Backup Power: Provides an efficient, low-loss path in inverter H-bridges or bypass switches, enhancing system overload and short-circuit withstand capability.
Low-Voltage High-Current Load Switch: Ideal for hot-swap, power path management, smart power distribution units, and other applications requiring extremely low voltage drop and high reliability. Selection Summary: The PSMNR98-25YLEX-VB, with its core advantages of 40V withstand voltage, 150A current, 0.7mΩ ultra-low on-resistance, and SGT technology, combined with the excellent heat dissipation and low parasitic characteristics of the LFPAK56 package, offers a highly competitive single-tube solution for high power density and high thermal challenge scenarios. Compared to traditional multi-tube parallel solutions, it effectively reduces parasitic parameter dispersion, simplifies PCB layout, and improves overall system reliability, making it a high-performance preferred model for low-voltage, high-current power switching and conversion applications.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

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