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NTMYS3D8N04CLTWG-VB Product details

Product introduction:

NTMYS3D8N04CLTWG-VB is a Single N-MOSFET deeply optimized for low-voltage, high-power switching scenarios, using Trench technology to combine ultra-low on-resistance with excellent switching characteristics; the LFPAK56 package achieves outstanding heat dissipation and current-carrying capacity in a compact footprint. The combination of 40V withstand voltage, 100A continuous current, and 2mΩ-level on-resistance makes it a high-performance core device in low-voltage, high-density power supplies, motor drives, and battery management applications, especially for systems with strict efficiency and thermal dissipation requirements.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
LFPAK56 Single-N 40V 1.4V 100A 2.4(mΩ) 2(mΩ) Trench
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
LFPAK56 Single-N Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
LFPAK56 Single-N 40V 1.4V 100A Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
LFPAK56 Single-N 40V 1.4V 100A Trench
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
LFPAK56 Single-N

VDS=40V: Covers 5V/12V/24V and some 36V systems, with ample voltage spike margin, suitable for higher bus voltage scenarios.
VGS=±20V: Compatible with a wide gate drive range, supporting flexible design from logic level to 10V+ drive, reducing driver circuit complexity.
Vth=1.4V (Typical): Turns on with low-voltage drive; combined with low threshold characteristics, suitable for power supply environments with battery voltage fluctuations.
RDS(on)=2mΩ @ VGS=10V, 2.4mΩ @ VGS=4.5V: Extremely low on-resistance, very low full-load losses, significantly reducing PCB cooling requirements, supporting higher power density designs.
ID=100A: High continuous current capability, easily handling high-power load surges, suitable for transient high-current scenarios like aluminum electrolytic capacitor charging and motor stall.
Package LFPAK56: Low parasitic inductance and low thermal resistance design, supporting high-frequency switching and high-current conduction, while saving board space and improving system reliability.

Domain and module applications:


Low-Voltage High-Power DC-DC Converters: Replaces traditional DPAK devices in synchronous rectification/buck circuits, significantly improving heavy-load efficiency, facilitating module miniaturization and high-power output.
Motor Drive and Control: 100A current capability covers high-current drive needs for power tools, drones, robots, etc., low PWM switching losses, smooth motor operation.
Battery Protection and BMS: Milliohm-level internal resistance reduces protection board heat generation, ultra-low conduction voltage drop improves system runtime, fast turn-off capability ensures short circuit safety.
Automotive 12V/24V Systems: 40V withstand voltage combined with a wide operating temperature range, suitable for automotive load switches, electronic fuses, and power management modules, high reliability.
Server and Communication Power Supplies: High-efficiency synchronous rectification and OR-ing circuits reduce rack power consumption and increase power density.
Electric Forklift/AGV Drives: High current margin and package with excellent thermal dissipation match frequent start-stop conditions, extending controller lifespan.
High-Power LED Lighting Drives: Low voltage drop reduces constant current losses, supports high-current parallel architecture, improving overall lamp efficiency and stability. Selection Summary: NTMYS3D8N04CLTWG-VB integrates 40V withstand voltage, 100A high current, and 2mΩ ultra-low on-resistance in an LFPAK56 package, achieving an excellent balance between performance margin, thermal dissipation capability, and system size. It is a high-performance general-purpose choice for low-voltage high-power switching applications, especially suitable for projects with strict requirements on efficiency, temperature rise, and reliability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

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