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RJK0328DPB-01#J0-VB Product details
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RJK0328DPB-01#J0-VB is a Single N-MOS optimized for low-voltage high-power switching applications, utilizing Trench technology to achieve extremely low conduction losses and fast switching characteristics. The LFPAK56 package strikes an excellent balance between heat dissipation capability and board footprint. The combination of 30V voltage tolerance, 90A current carrying capacity, and 2.8mΩ on-resistance makes it a preferred device for high-density, high-current applications such as server power supplies, power tools, and automotive electronics.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 30V | 0.8V | 90A | 3.36(mΩ) | 2.8(mΩ) | Trench |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 30V | 0.8V | 90A | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 30V | 0.8V | 90A | Trench |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N |
VDS=30V: Adapts to 5V/12V/24V systems, providing sufficient voltage margin for switching spikes, reducing avalanche breakdown risk.
VGS=±20V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, simplifying driver circuit design.
Vth=0.8V (typical): Ultra-low threshold voltage, supports low-voltage drive scenarios, ensures reliable turn-on even when battery voltage decays.
RDS(on)=2.8mΩ @ VGS=10V, 3.36mΩ @ VGS=4.5V: Extremely low on-resistance, significantly reduces full-load temperature rise, can reduce heatsink or copper area requirements.
ID=90A: Ample continuous current margin, can confidently handle high transient current demands like motor start-up and short-circuit surges.
Package LFPAK56: Low parasitic inductance, low thermal resistance, supports high-frequency high-current switching, saves PCB space and improves system power density.
Domain and module applications：
High-Current DC-DC Converters: Replacing Schottky diodes in synchronous rectification applications, conduction losses can be reduced by an order of magnitude, significantly improving heavy-load efficiency.
Power Tools and Garden Machinery: 90A current capability and low on-resistance ensure controllable temperature rise in motor controllers under high-torque output.
Automotive Electronics and Onboard Power Supplies: 30V voltage margin accommodates 12V/24V vehicle bus load dump transients, and the LFPAK56 package is suitable for compact ECU designs.
Server and Communication Power Supplies: High efficiency and low thermal resistance characteristics meet the thermal constraints of high-power-density modules, supporting hot-swap and continuous full-load operation.
Battery Protection Boards and BMS: Milliohm-level on-resistance reduces self-heating of the protection board, and fast switching capability ensures timely overcurrent/short-circuit protection action.
Low-Voltage Motor Drives: Extremely low PWM switching losses improve speed regulation linearity, suitable for scenarios with high response speed requirements such as drones and robots.
Power OR-ing Circuits: Extremely low forward voltage drop equivalent resistance reduces voltage drop losses in multi-power redundant systems, improving overall system efficiency. Selection Summary: The RJK0328DPB-01#J0-VB, with its 2.8mΩ ultra-low on-resistance, 90A high-current capability, and low threshold voltage as core advantages, combined with the excellent thermal performance and low parasitic parameters of the LFPAK56 package, is a high-performance general-purpose choice for 30V low-voltage high-power switching applications, especially suitable for projects with strict requirements on efficiency, temperature rise, and power density.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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