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PSMN010-25YLC,115-VB Product details

Product introduction:

**Product Introduction**PSMN010-25YLC,115-VB is a Single N-MOS optimized for low-voltage high-current power switching scenarios. Trench technology balances ultra-low on-resistance with fast switching capability, and the LFPAK56 package achieves an excellent balance between thermal performance and footprint. The combination of 30V voltage rating, 90A current-carrying capacity, and 2.8mΩ on-resistance makes it an ideal cost-effective alternative to traditional DPAK or D2PAK packaged devices, especially suitable for high-density, high-current, high-reliability power system applications.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
LFPAK56 Single-N 30V 0.8V 90A 3.36(mΩ) 2.8(mΩ) Trench
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
LFPAK56 Single-N Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
LFPAK56 Single-N 30V 0.8V 90A Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
LFPAK56 Single-N 30V 0.8V 90A Trench
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
LFPAK56 Single-N

- **VDS=30V**: Suitable for 5V/12V/24V systems, providing sufficient voltage margin for spikes, reducing avalanche breakdown risk.
- **VGS=±20V**: Compatible with a wide range of gate drive voltages, can be directly connected to MCU/PMIC or dedicated drivers, no need for additional level shifters.
- **Vth=0.8V (Typical)**: Low threshold voltage enables turn-on with low-voltage drive, ideal for battery-powered and low-voltage logic control applications.
- **RDS(on)=2.8mΩ @ VGS=10V**: Ultra-low on-resistance, minimal conduction losses at full load, significantly reduces temperature rise, can reduce heatsink or copper area.
- **RDS(on)=3.36mΩ @ VGS=4.5V**: Maintains very low on-resistance even with low-voltage drive, supports efficient operation with 4.5V logic levels.
- **ID=90A**: High continuous current capability, easily handles steady-state and transient current demands of high-power loads.
- **Package LFPAK56**: Industry standard power package, low thermal resistance, low parasitic inductance, supports high-density mounting, increases system power density.

Domain and module applications:


- **DC-DC Converters**: Replaces Schottky in synchronous rectification or buck/boost topologies, improving heavy-load efficiency by 2~3%, benefiting module miniaturization and high-power-density design.
- **Motor Drives**: Ultra-low on-resistance and 90A high current capability support high torque output for brushed/brushless motors, with low PWM switching loss and significantly reduced controller temperature rise.
- **Battery Protection Modules**: Microsecond fast switching combined with extremely low on-resistance ensures reliable shutdown during overcurrent/short circuit, while reducing self-heating of the protection board, extending battery life.
- **Vehicle Power Systems**: 30V withstand voltage and wide operating temperature range suit 12V/24V vehicle bus systems, applicable to body control, auxiliary power, and electronic control units.
- **Server and Communication Power Supplies**: High current carrying capacity meets the needs of high-power-density modules, low conduction loss improves overall energy efficiency, and reduces heat sink costs.
- **Power Tools**: High current output capability and low on-resistance characteristics match the demanding conditions of frequent start/stop and high torque loads in power tools, improving reliability.
- **Power OR-ing Circuits**: Low forward voltage drop replaces ideal diode control circuits, reducing losses, suitable for redundant power systems. **Selection Summary**: The PSMN010-25YLC,115-VB achieves an excellent balance between ultra-low on-resistance, high current carrying capacity, package heat dissipation, and system cost. It is a high-performance general-purpose choice for 30V low-voltage high-current switching applications, especially suitable for projects with strict requirements on efficiency, heat dissipation, and power density.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

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* If you have any questions about the product, please fill out the form to submit, we will reply you within 24 hours

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