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PH6030AL,115-VB Product details

Product introduction:

PH6030AL,115-VB is a Single N-MOS deeply optimized for low-voltage, high-power switching applications. Using Trench technology, it combines extremely low on-resistance with high switching reliability. The LFPAK56 package achieves an excellent balance between heat dissipation and parasitic parameter control, making it particularly suitable for power systems requiring high current density and high reliability. The combination of 30V voltage rating, 90A continuous current capability, and 2.8mΩ-level on-resistance makes it an ideal power device choice for medium-to-high-power applications such as server power supplies, power tools, and automotive electronics.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
LFPAK56 Single-N 30V 0.8V 90A 3.36(mΩ) 2.8(mΩ) Trench
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
LFPAK56 Single-N Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
LFPAK56 Single-N 30V 0.8V 90A Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
LFPAK56 Single-N 30V 0.8V 90A Trench
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
LFPAK56 Single-N
VDS=30V: Adapts to 5V/12V/24V power buses, reserving sufficient voltage margin for switching spikes, enhancing system avalanche ruggedness.
VGS=±20V: Wide gate voltage range, compatible with 3.3V~12V drive logic, can be controlled directly by MCU/PMIC or dedicated gate drivers.
Vth=0.8V (typical): Low threshold voltage ensures reliable turn-on under low-voltage drive conditions, suitable for battery-powered and low-voltage hot-swap scenarios.
RDS(on)=2.8mΩ @ VGS=10V: Ultra-low on-resistance, significantly reduces full-load conduction loss, effectively controls temperature rise, allows for reduced heat sink or copper area.
RDS(on)=3.36mΩ @ VGS=4.5V: Maintains extremely low on-resistance even when driven by 4.5V logic level, suitable for low-voltage portable and energy-saving applications.
ID=90A: Ample continuous current capability, meets heavy-load demands of high-power motors, battery main circuits, and synchronous rectification, with high reliability margin.
Package LFPAK56: Compact size, combined with excellent thermal path and low package resistance, supports high-density layout and high-frequency switching operation.

Domain and module applications:


Server/Communication Power Supplies: Ultra-low on-resistance improves synchronous rectification efficiency, significantly reducing overall power consumption, suitable for high-current DC-DC modules.
Power Tools and Garden Machinery: 90A high-current capability matches high-load impacts, Trench process ensures stable operation at high switching frequencies, extending tool life.
Battery Protection and BMS: Extremely low internal resistance reduces protection board heat generation, fast switching characteristics ensure reliable shutdown during overcurrent/short circuit, enhancing system safety.
Automotive Electronic Auxiliary Systems: 30V voltage margin covers 12V automotive bus transient overvoltage, wide temperature range adapts to harsh engine compartment environments.
Low-voltage High-current Motor Drives: Low PWM dead-time losses, smooth motor operation, controller temperature rise significantly lower than traditional packaged devices.
High-density Power Boards: LFPAK56 packaging saves PCB area while efficiently conducting heat through the bottom thermal pad, supporting module miniaturization.
Drone and Robot Power Supplies: Lightweight packaging combined with low conduction voltage drop extends battery life and improves power system response speed.
Selection Summary: The PH6030AL,115-VB achieves an excellent balance between ultra-low on-resistance, high current carrying capacity, and compact packaging, making it a high-performance general-purpose choice for 30V low-voltage high-power switching applications, especially suitable for power, power tool, and automotive electronic projects with stringent requirements for efficiency, thermal management, and power density.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

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