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PH3330L,115-VB Product details
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PH3330L,115-VB is a Single N-MOS deeply optimized for low-voltage high-power switching scenarios. The Trench process balances extremely low conduction loss with high switching reliability. The LFPAK56 package achieves an excellent balance between thermal performance and board footprint. With 30V withstand voltage, 90A current capacity, and 2.8mΩ on-resistance, it is an ideal high-cost-performance option for replacing traditional DPAK or SOP-8 package devices, especially suitable for high-current, high-density power systems.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 30V | 0.8V | 90A | 3.36(mΩ) | 2.8(mΩ) | Trench |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 30V | 0.8V | 90A | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N | 30V | 0.8V | 90A | Trench |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| LFPAK56 | Single-N |
VDS=30V: Suitable for 5V/12V/24V systems, provides sufficient voltage spike margin, reduces avalanche breakdown risk.
VGS=±20V: Compatible with 1.8V~12V logic levels, can be directly connected to MCU/PMIC, eliminating level shifting circuits.
Vth=0.8V (Typical): Can enter full conduction region under low-voltage drive, especially suitable for battery voltage decay or low-voltage drive scenarios.
RDS(on)=2.8mΩ @ VGS=10V, 3.36mΩ @ VGS=4.5V: Ultra-low on-resistance, greatly reduces temperature rise under full load, can significantly reduce heat dissipation copper area.
ID=90A: Ample continuous current margin, can handle peak demands of servers, power tools, and automotive high-power loads.
Package LFPAK56: Low parasitic parameters, excellent thermal resistance characteristics, supports high-frequency switching, saves PCB area and improves power density.
Domain and module applications：
DC-DC Converters: Replaces Schottky in synchronous rectification, extremely low on-resistance significantly improves heavy-load efficiency, facilitating module miniaturization.
Power Tools & Motor Drives: 90A high current capability combined with low RDS(on), low PWM switching losses, smoother motor operation, significantly reduced controller temperature rise.
Server Power & Telecom Power Supplies: In low-voltage high-current bus scenarios, high efficiency can reduce overall system heat dissipation pressure, improving system reliability.
Battery Protection Modules: Microsecond-level fast shutdown response ensures reliable protection during overcurrent/short circuit, low on-resistance reduces protection board self-heating.
Automotive Auxiliary Power Supplies: Withstand voltage margin and wide operating temperature range adapt to 12V/24V automotive buses, high reliability.
Portable Device Fast Charging & Power Management: Ultra-low on-resistance improves boost/buck efficiency, LFPAK56 package balances heat dissipation and slim design.
LED Lighting Drivers: Low conduction voltage drop reduces constant current source power consumption, supports multi-channel parallel connection, improving overall luminaire efficacy.
Selection Summary: PH3330L,115-VB achieves an excellent balance between performance margin, package size, and system cost. It is a cost-effective general-purpose choice for 30V low-voltage high-current switching applications, especially suitable for projects with strict requirements on efficiency and heat dissipation.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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