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MCU017N10YLQ-TP-VB Product details

Product introduction:

MCU017N10YLQ-TP-VB is a Single N-MOSFET deeply optimized for medium-to-low voltage power switching scenarios, using Trench technology to balance low conduction losses and high switching reliability. The TO252 (DPAK) package achieves a good balance between heat dissipation capability and space occupation, making it suitable for applications with high thermal requirements such as industrial control, power conversion, and motor drive. The combination of 100V withstand voltage, 45A current capacity, and 18mΩ on-resistance makes it a preferred alternative to similar DPAK-packaged models, especially for medium-to-high power-density designs.

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Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
TO252 Single-N 100V 1.8V 45A 18(mΩ) Trench
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
TO252 Single-N Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
TO252 Single-N 100V 1.8V 45A Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
TO252 Single-N 100V 1.8V 45A Trench
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
TO252 Single-N
VDS=100V: Suitable for 24V/48V/60V systems, provides ample voltage spike margin, significantly reduces avalanche breakdown risk, and enhances system robustness.
VGS=±20V: Compatible with 5V~12V logic level drives, can directly connect to MCU/PWM controllers, simplifying gate drive circuit design.
Vth=1.8V (Typical): Moderate threshold voltage ensures effective turn-on under low-voltage drive while maintaining good immunity to false turn-on, suitable for wide temperature range operation.
RDS(on)=18mΩ @ VGS=10V: Ultra-low on-resistance significantly reduces full-load conduction losses, allowing for smaller heatsink size and optimized system thermal design.
ID=45A: Ample continuous current capability to handle transient peak current demands such as motor startup and power supply overloads, ensuring high reliability.
Package TO252 (DPAK): Low thermal resistance, short heat dissipation path, suitable for medium-power PCB layouts, and compatible with automated assembly to reduce manufacturing costs.

Domain and module applications:


DC-DC Converters: Replace Schottky diodes in synchronous rectification or boost topologies, significantly improving heavy-load efficiency. Suitable for communication power supplies and server power modules.
Motor Drive Control: Low on-resistance and fast switching characteristics reduce PWM losses, ensuring smoother motor operation and significantly lower controller temperature rise.
Lithium Battery Protection and Charge/Discharge Management: 100V withstand voltage covers multi-cell battery pack applications, 45A current capability meets high-power charge/discharge circuit requirements, and low internal resistance reduces self-heating of the protection board.
Industrial Power Supplies and Adapters: Wide voltage margin enhances surge immunity, TO252 package facilitates heat dissipation design, suitable for 12V/24V industrial auxiliary power supplies.
Automotive Electronic Systems: Suitable for 12V/24V vehicle bus environments, withstands load dump voltage spikes, and with stable thermal performance, ensures long-term operational reliability.
Power Switches and Load Switches: Logic-level direct drive simplifies peripheral circuits, can be used in high-volume applications such as intelligent power distribution and remote control switches, achieving low-cost, high-reliability solutions.
Power Tools and Garden Machinery: High current density and low internal resistance meet high-torque startup requirements, Trench process ensures durability under harsh conditions.
Selection Summary: MCU017N10YLQ-TP-VB achieves a balance between voltage margin, current-carrying capacity, conduction loss, and package thermal performance. It is a cost-effective general-purpose power switch solution in the 100V voltage class, especially suitable for power supply and motor control projects with strict requirements for thermal reliability and overload capability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

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