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FTS1011-TL-E-VB Product details
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FTS1011-TL-E-VB is a Single P-MOS deeply optimized for low-voltage power switching applications. Trench technology balances low switching loss and high reliability. The TSSOP8 package strikes a balance between heat dissipation and board space. The combination of 20V withstand voltage, 9A current capacity, and 16mΩ on-resistance makes it an ideal cost-reduction incremental option for replacing traditional SOP-8 or SOT-23 packaged devices, especially suitable for high-density, high-volume applications.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| TSSOP8 | Single-P | -20V | -1.7V | -9A | 20(mΩ) | 16(mΩ) | Trench |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| TSSOP8 | Single-P | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| TSSOP8 | Single-P | -20V | -1.7V | -9A | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| TSSOP8 | Single-P | -20V | -1.7V | -9A | Trench |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| TSSOP8 | Single-P |
VDS=-20V: Suitable for 5V/12V systems, provides sufficient voltage margin for load transients, reducing avalanche breakdown risk.
VGS=±20V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, eliminating level-shifting circuits.
Vth=-1.7V (typical): Fully enters the conduction region even with low-voltage drive, ideal for battery voltage decay scenarios.
RDS(on)=16mΩ @ VGS=10V: Ultra-low on-resistance, significantly reduces full-load temperature rise, can reduce heat sink copper area.
ID=-9A: Ample continuous current margin, handles peak demands of most portable and automotive auxiliary loads.
Package TSSOP8: Small size, low parasitic parameters, supports high-frequency switching, saves PCB area and assembly cost.
VGS=±20V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, eliminating level-shifting circuits.
Vth=-1.7V (typical): Fully enters the conduction region even with low-voltage drive, ideal for battery voltage decay scenarios.
RDS(on)=16mΩ @ VGS=10V: Ultra-low on-resistance, significantly reduces full-load temperature rise, can reduce heat sink copper area.
ID=-9A: Ample continuous current margin, handles peak demands of most portable and automotive auxiliary loads.
Package TSSOP8: Small size, low parasitic parameters, supports high-frequency switching, saves PCB area and assembly cost.
Domain and module applications：
Portable Device Power Management: Low internal resistance improves negative voltage supply or load switch efficiency, extends battery life, small package aids ultra-thin design.
Battery Protection Modules: Fast response ensures microsecond shutdown during overcurrent/short circuit, low internal resistance reduces protection board self-heating.
Low-Voltage Motor Drive: Low PWM switching losses, smoother motor operation, significantly lower controller temperature rise.
Consumer Electronics Control Modules: Logic-level direct drive simplifies peripherals, suitable for high-volume, low-cost products like smart sockets and USB switches.
LED Lighting Drive: Low on-resistance reduces constant current source power consumption, supports multiple parallel branches, improves overall light efficiency.
DC-DC Converters: Replaces traditional P-MOS in synchronous rectification or load switches, improves heavy-load efficiency, facilitates module miniaturization.
Vehicle Auxiliary Power: Voltage margin and wide operating temperature range adapt to 12V vehicle bus, high reliability. Selection Summary: FTS1011-TL-E-VB achieves a balance between performance margin, package size, and system cost, making it a cost-effective general-purpose choice for 20V low-voltage P-channel switching applications, especially suitable for projects with strict space and thermal requirements.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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