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ZXM64N03XTA-VB Product details
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The ZXM64N03XTA-VB is a Single N-MOS deeply optimized for low-voltage power switching scenarios. Trench technology balances low switching losses with high reliability, and the MSOP8 package strikes a balance between heat dissipation and board area. The combination of 20V voltage rating, 7A current capability, and 13mΩ on-resistance makes it an ideal cost-effective incremental replacement for traditional SOP-8 packaged devices, especially suitable for high-density, high-volume applications.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| MSOP8 | Single-N | 20V | 0.74V | 7A | 25(mΩ) | 15(mΩ) | 13(mΩ) | Trench |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| MSOP8 | Single-N | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| MSOP8 | Single-N | 20V | 0.74V | 7A | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| MSOP8 | Single-N | 20V | 0.74V | 7A | Trench |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| MSOP8 | Single-N |
VDS=20V: Suitable for 5V/12V low-voltage systems, providing spike voltage margin, reducing avalanche breakdown risk.
VGS=±12V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, eliminating level-shifting circuits.
Vth=0.74V (typical): Can enter full conduction region even under low-voltage drive, especially suitable for battery voltage decay scenarios.
RDS(on)=13mΩ @ VGS=10V: Ultra-low on-resistance, significantly reduces full-load temperature rise, can reduce heat sink copper area.
ID=7A: Ample continuous current margin, can handle peak demands of most portable and low-voltage auxiliary loads.
Package MSOP8: Small size, low parasitic parameters, supports high-frequency switching, while saving PCB area and assembly cost.
VGS=±12V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, eliminating level-shifting circuits.
Vth=0.74V (typical): Can enter full conduction region even under low-voltage drive, especially suitable for battery voltage decay scenarios.
RDS(on)=13mΩ @ VGS=10V: Ultra-low on-resistance, significantly reduces full-load temperature rise, can reduce heat sink copper area.
ID=7A: Ample continuous current margin, can handle peak demands of most portable and low-voltage auxiliary loads.
Package MSOP8: Small size, low parasitic parameters, supports high-frequency switching, while saving PCB area and assembly cost.
Domain and module applications：
Portable Device Power Management: Low on-resistance improves boost/buck efficiency, extends battery life, and the small package aids ultra-thin design.
Battery Protection Module: Fast response ensures microsecond-level shutdown during overcurrent/short circuit; low on-resistance reduces self-heating of the protection board.
Low-Voltage Motor Drive: Low PWM switching losses result in smoother motor operation and significantly lower controller temperature rise.
Consumer Electronics Control Module: Logic-level direct drive simplifies peripheral circuits, suitable for high-volume, low-cost products like smart sockets and USB switches.
LED Lighting Driver: Low on-state voltage drop reduces constant current source power consumption, supports multi-channel parallel connection, improving overall luminaire efficacy.
DC-DC Converter: Replaces Schottky diodes in synchronous rectification, improving heavy-load efficiency by 2-3%, facilitating module miniaturization.
Low-Voltage Auxiliary Power Supply: Voltage margin and wide operating temperature range adapt to battery-powered systems with high reliability. Selection Summary: The ZXM64N03XTA-VB achieves a balance between performance margin, package size, and system cost. It is a cost-effective, versatile choice for 20V low-voltage switching applications, particularly suitable for projects with strict space and thermal dissipation requirements.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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