Featured Model

Last updated:

NTGS3A033PZT1G-VB Product details

Product introduction:

NTGS3A033PZT1G-VB is a Single P-MOS deeply optimized for low-voltage power switch applications. The Trench process balances low switching loss and high reliability, while the SOT23-6 package strikes a balance between heat dissipation and board space. The combination of 30V withstand voltage, 4.8A current capability, and 49mΩ on-resistance makes it an ideal cost-reducing incremental option for replacing traditional DPAK or SOP-8 packaged devices, especially suitable for high-density, high-volume applications.

File download

Download PDF document
Download now

Product parameter:

VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds2.5 Rds4.5 Rds10 Technology
SOT23-6 Single-P -30V -1.7V -4.8A 54(mΩ) 49(mΩ) Trench
VB Package Configuration VCE VGE VGEth(V) VCEsat15V ICE Technology
SOT23-6 Single-P Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds18 Technology
SOT23-6 Single-P -30V -1.7V -4.8A Trench
VB Package Configuration VDS(V) VGS Vthyp(V) ID(A) Rds6 Technology
SOT23-6 Single-P -30V -1.7V -4.8A Trench
VB Package Polarity Vz / VR Pd VF IF IR Cd Type
SOT23-6 Single-P
Product Parameters (Key Selection Decision Points) VDS=-30V: Suitable for 12V/24V negative power supply systems or high-side switch applications, providing sufficient negative voltage spike margin to reduce avalanche breakdown risk. VGS=±20V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, eliminating level-shifting circuits. Vth=-1.7V (typical): Allows full conduction region entry even under low-voltage drive, especially suitable for P-channel switch control in battery voltage decay scenarios. RDS(on)=49mΩ @ VGS=10V (54mΩ @ VGS=4.5V): Optimized on-resistance, significantly reduced temperature rise at full load, can reduce heat sink copper area. ID=-4.8A: Ample continuous current margin, capable of handling peak demands of most portable and automotive auxiliary loads. Package SOT23-6: Small size, low parasitic parameters, supports high-frequency switching, saves PCB area and assembly cost, and facilitates multi-pin heat dissipation design.

Domain and module applications:


(Decision Value Analysis)
Portable Device Power Management: Low internal resistance improves load switch efficiency, extends battery life, and small packaging enables ultra-thin designs. Battery Protection Module: Fast response ensures microsecond shutdown during overcurrent/short circuit, and low internal resistance reduces self-heating of the protection board.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features

Technical support:

* If you have any questions about the product, please fill out the form to submit, we will reply you within 24 hours

Sample Req

QQ

Telephone

400-655-8788

WeChat

WeChat

Topping

Sample Req
Online
Telephone
WeChat