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PMN25EN,115-VB Product details
Back to previous pageProduct introduction：
PMN25EN,115-VB is a Single N-MOS deeply optimized for low-voltage power switching scenarios. The Trench process balances low switching loss and high reliability, while the SOT23-6 package achieves a balance between heat dissipation and board area. The combination of 30V withstand voltage, 6A current-carrying capacity, and 26mΩ on-resistance makes it an ideal cost-reducing incremental option to replace traditional DPAK or SOP-8 packaged devices, especially suitable for high-density, high-volume applications.
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Product parameter：
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds2.5 | Rds4.5 | Rds10 | Technology |
|---|---|---|---|---|---|---|---|---|---|
| SOT23-6 | Single-N | 30V | 1.7V | 6A | 27(mΩ) | 26(mΩ) | Trench |
| VB Package | Configuration | VCE | VGE | VGEth(V) | VCEsat15V | ICE | Technology |
|---|---|---|---|---|---|---|---|
| SOT23-6 | Single-N | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds18 | Technology |
|---|---|---|---|---|---|---|---|
| SOT23-6 | Single-N | 30V | 1.7V | 6A | Trench |
| VB Package | Configuration | VDS(V) | VGS | Vthyp（V） | ID(A) | Rds6 | Technology |
|---|---|---|---|---|---|---|---|
| SOT23-6 | Single-N | 30V | 1.7V | 6A | Trench |
| VB Package | Polarity | Vz / VR | Pd | VF | IF | IR | Cd | Type |
|---|---|---|---|---|---|---|---|---|
| SOT23-6 | Single-N |
(Selection Decision Points)
VDS=30V: Compatible with 5V/12V/24V systems, providing sufficient margin for voltage spikes and reducing avalanche breakdown risk.
VGS=±20V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, eliminating level-shifting circuits.
Vth=1.7V (Typical): Fully enters the conduction region even at low drive voltages, especially suitable for battery voltage decay scenarios.
RDS(on)=26mΩ @ VGS=10V, 27mΩ @ VGS=4.5V: Ultra-low on-resistance with low sensitivity to drive voltage, significantly reducing full-load temperature rise and allowing for smaller heat sink copper area.
ID=6A: Ample continuous current margin to handle peak demands of most portable and automotive auxiliary loads.
Package SOT23-6: Small size, low parasitic parameters, supports high-frequency switching, while saving PCB area and assembly cost.
VDS=30V: Compatible with 5V/12V/24V systems, providing sufficient margin for voltage spikes and reducing avalanche breakdown risk.
VGS=±20V: Compatible with 1.8V~12V logic levels, can directly connect to MCU/PMIC, eliminating level-shifting circuits.
Vth=1.7V (Typical): Fully enters the conduction region even at low drive voltages, especially suitable for battery voltage decay scenarios.
RDS(on)=26mΩ @ VGS=10V, 27mΩ @ VGS=4.5V: Ultra-low on-resistance with low sensitivity to drive voltage, significantly reducing full-load temperature rise and allowing for smaller heat sink copper area.
ID=6A: Ample continuous current margin to handle peak demands of most portable and automotive auxiliary loads.
Package SOT23-6: Small size, low parasitic parameters, supports high-frequency switching, while saving PCB area and assembly cost.
Domain and module applications：
Decision Value Analysis
Portable Device Power Management: Low internal resistance improves boost/buck efficiency, extends battery life, and small package enables ultra-thin design. Battery Protection Module: Fast response ensures microsecond shutdown during overcurrent/short circuit, low internal resistance reduces self-heating of the protection board. Low-Voltage Motor Drive: Low PWM switching loss, smoother motor operation, significantly reduced controller temperature rise. Consumer Electronics Control Module: Logic-level direct drive simplifies peripherals, suitable for high-volume low-cost products like smart sockets and USB switches. LED Lighting Drive: Low conduction voltage drop reduces constant current source power consumption, supports multi-channel parallel connection, improving overall light efficiency.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
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