Product parameter:
| VB Package |
Configuration |
VDS(V) |
VGS |
Vthyp(V) |
ID(A) |
Rds2.5 |
Rds4.5 |
Rds10 |
Technology |
| SOP8 |
Single-P-Channel |
-30V |
|
-2.5V |
-11.6A |
|
12(mΩ) |
11(mΩ) |
Trench |
| VB Package |
Configuration |
VCE |
VGE |
VGEth(V) |
VCEsat15V |
ICE |
Technology |
| SOP8 |
Single-P-Channel |
|
|
|
|
|
Trench |
| VB Package |
Configuration |
VDS(V) |
VGS |
Vthyp(V) |
ID(A) |
Rds18 |
Technology |
| SOP8 |
Single-P-Channel |
-30V |
|
-2.5V |
-11.6A |
|
Trench |
| VB Package |
Configuration |
VDS(V) |
VGS |
Vthyp(V) |
ID(A) |
Rds6 |
Technology |
| SOP8 |
Single-P-Channel |
-30V |
|
-2.5V |
-11.6A |
|
Trench |
| VB Package |
Polarity |
Vz / VR |
Pd |
VF |
IF |
IR |
Cd |
Type |
| SOP8 |
Single-P-Channel |
|
|
|
|
|
|
|
**Detailed parameter description:** - **Channel Type:** P—Channel - **Maximum Drain Current:** -11.6A - **Maximum Drain-Source Voltage:** -30V - **On-Resistance:** RDS(ON)=11mΩ @ VGS=10V, 12mΩ@VGS=4.5V; , VGS=±20V - **Gate Threshold Voltage:** Vth=-2.5V
Domain and module applications:
1. **Power switch module:** Due to the P-Channel structure of TPC8126-VB, it is suitable for power switch module to achieve efficient power control and management. 2. **Current control module:** Due to its high leakage current and low on-resistance, it can be used in current control module to ensure accurate control of load current. 3. **Power amplifier module:** Suitable for power amplifier module, with sufficient leakage current and on-resistance, to provide reliable power amplification function. 4. **Battery protection module:** Suitable for battery protection circuit to provide effective protection for the battery. **Precautions for use:** - Please use it according to the specifications and application guides provided by the manufacturer, and ensure that the operating conditions are within the specified range of the component. - Ensure that the circuit design is reasonable to prevent damage to the device due to overcurrent, overvoltage, etc. - Pay attention to proper heat dissipation design, especially in high-power applications, to ensure that the device is within the normal operating temperature range. - Follow the relevant standards for welding and packaging to ensure reliable connection between the device and the circuit board.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
Technical support:
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