Product introduction:
TPH5R906NH,L1Q-VB is a Single N-MOSFET deeply optimized for low-voltage high-current power switching scenarios. The Trench process achieves an excellent balance between conduction losses and switching speed, and the DFN8(5X6) package balances thermal performance and compact footprint. The combination of 60V withstand voltage, 80A current carrying capacity, and 6mΩ ultra-low on-resistance makes it an ideal choice for high-power-density power supplies, motor drives, and battery protection applications, especially suitable for systems with stringent thermal and efficiency requirements.
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Product parameter:
| VB Package |
Configuration |
VDS(V) |
VGS |
Vthyp(V) |
ID(A) |
Rds2.5 |
Rds4.5 |
Rds10 |
Technology |
| DFN8(5X6) |
Single-N |
60V |
|
2.5V |
80A |
|
7(mΩ) |
6(mΩ) |
Trench |
| VB Package |
Configuration |
VCE |
VGE |
VGEth(V) |
VCEsat15V |
ICE |
Technology |
| DFN8(5X6) |
Single-N |
|
|
|
|
|
Trench |
| VB Package |
Configuration |
VDS(V) |
VGS |
Vthyp(V) |
ID(A) |
Rds18 |
Technology |
| DFN8(5X6) |
Single-N |
60V |
|
2.5V |
80A |
|
Trench |
| VB Package |
Configuration |
VDS(V) |
VGS |
Vthyp(V) |
ID(A) |
Rds6 |
Technology |
| DFN8(5X6) |
Single-N |
60V |
|
2.5V |
80A |
|
Trench |
| VB Package |
Polarity |
Vz / VR |
Pd |
VF |
IF |
IR |
Cd |
Type |
| DFN8(5X6) |
Single-N |
|
|
|
|
|
|
|
VDS=60V: Suitable for 12V/24V/48V systems, providing ample voltage margin to effectively suppress spike breakdown risk and improve reliability.
VGS=±20V: Compatible with a wide range of gate drive voltages, flexibly adaptable to 4.5V~12V logic levels, simplifying drive circuit design.
Vth=2.5V (Typical): Moderate threshold voltage balancing noise immunity and low-voltage drive feasibility, ensuring stable turn-on under various drive conditions.
RDS(on)=6mΩ @ VGS=10V, 7mΩ @ VGS=4.5V: Ultra-low on-resistance significantly reduces conduction losses, resulting in lower full-load temperature rise, allowing for smaller heatsinks or copper area and improving system power density.
ID=80A: Ample continuous current capability to handle large current surges and sustained heavy load conditions, suitable for high-power output scenarios.
Package DFN8(5X6): Features a bottom-side thermal pad design for low thermal resistance and efficient heat transfer; also has low parasitic parameters beneficial for high-frequency switching applications, saving PCB area.
Domain and module applications:
High-power DC-DC converters: In synchronous rectification or buck/boost topologies, ultra-low RDS(on) can significantly improve heavy-load efficiency and reduce power stage heat generation.
Motor drive modules: 80A high current capacity meets the PWM drive requirements of high-power motors such as power tools and robots, with low switching losses for smoother operation.
Lithium battery protection boards: 60V withstand voltage combined with fast switching characteristics ensures reliable turn-off during overcurrent/short circuit, low on-resistance reduces the temperature rise of the protection board itself.
Automotive power systems: Adapts to 12V/24V automotive buses, wide safe operating area and high reliability meet harsh environments such as start-stop systems and electric power steering.
Server/communication power supplies: In high-density boards, the small DFN8(5X6) package combined with high current capability helps achieve high-efficiency, small-volume power modules.
Power adapters and chargers: Replaces traditional DPAK package devices, increasing power density, reducing overall system temperature rise, and extending product life.
Selection Summary: The TPH5R906NH,L1Q-VB achieves a high degree of balance between withstand voltage, on-resistance, current carrying capacity, and package thermal performance. It is a high-performance general-purpose choice for 60V low-voltage high-current switching applications, especially suitable for projects with strict requirements on efficiency, power density, and long-term reliability.
* Please note: the above is only an example application scenario, the specific application depends on the requirements and conditions of the system design. When using this device, consult its data sheet for detailed technical specifications and features
Technical support:
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