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Preface: Powering the Future of Care – A Systems Approach to Power Management in AI-Powered Medical and Wellness Robots
AI Medical & Wellness Robot Power Management System Topology

AI Medical Robot Power Management System Overall Topology

graph LR %% Power Source & Distribution subgraph "Power Source & Main Distribution" BATTERY["Li-ion Battery Pack
24V/48V DC"] --> PROTECTION["Battery Protection Circuit
OCP, OVP, UVP"] PROTECTION --> MAIN_BUS["Main Power Bus
20-50VDC"] end %% High-Current Motor Drive System subgraph "High-Current Motor Drive System" MAIN_BUS --> MOTOR_CONTROLLER["Motor Controller
MCU/Driver IC"] MOTOR_CONTROLLER --> GATE_DRIVER["Gate Driver Circuit"] GATE_DRIVER --> H_BRIDGE["H-Bridge Power Stage"] subgraph "H-Bridge MOSFET Array" Q_HIGH1["VBQF2207
P-Channel -20V/-52A"] Q_HIGH2["VBQF2207
P-Channel -20V/-52A"] Q_LOW1["N-Channel MOSFET
for Low Side"] Q_LOW2["N-Channel MOSFET
for Low Side"] end H_BRIDGE --> Q_HIGH1 H_BRIDGE --> Q_HIGH2 H_BRIDGE --> Q_LOW1 H_BRIDGE --> Q_LOW2 Q_HIGH1 --> MOTOR_TERMINAL1["Motor Terminal A"] Q_HIGH2 --> MOTOR_TERMINAL2["Motor Terminal B"] Q_LOW1 --> GND_MOTOR Q_LOW2 --> GND_MOTOR MOTOR_TERMINAL1 --> DC_MOTOR["Brushed/Brushless DC Motor
Wheel/Articulation"] MOTOR_TERMINAL2 --> DC_MOTOR subgraph "Motor Protection" SNUBBER["Snubber Circuit
TVS Diodes"] CURRENT_SENSE["Current Sensing
Shunt/Amplifier"] end DC_MOTOR --> SNUBBER CURRENT_SENSE --> MOTOR_CONTROLLER end %% Intelligent Power Distribution System subgraph "Intelligent Power Distribution" MAIN_BUS --> AUX_DCDC["Auxiliary DC-DC Converter
12V/5V/3.3V"] AUX_DCDC --> DISTRIBUTION_BUS["Distribution Power Bus"] subgraph "Multi-Channel Power Switches" SW_SENSORS["VBC6P2216
Channel 1: Sensor Array"] SW_COMPUTE["VBC6P2216
Channel 2: Computing Unit"] SW_COMM["VBC6P2216
Channel 3: Communication"] SW_PERIPHERAL["VBC6P2216
Channel 4: Peripherals"] end DISTRIBUTION_BUS --> SW_SENSORS DISTRIBUTION_BUS --> SW_COMPUTE DISTRIBUTION_BUS --> SW_COMM DISTRIBUTION_BUS --> SW_PERIPHERAL SW_SENSORS --> SENSOR_LOAD["Sensor Array
LiDAR, Cameras, IMU"] SW_COMPUTE --> COMPUTE_LOAD["Computing Unit
SoC, GPU, FPGA"] SW_COMM --> COMM_LOAD["Communication Module
WiFi, 5G, Bluetooth"] SW_PERIPHERAL --> PERIPHERAL_LOAD["Peripheral Loads
Gripper, Display, Audio"] subgraph "Power Management Controller" PMIC["Power Management IC/MCU"] PMIC --> CONTROL_SIGNALS["Digital Control Signals
GPIO/PWM"] end CONTROL_SIGNALS --> SW_SENSORS CONTROL_SIGNALS --> SW_COMPUTE CONTROL_SIGNALS --> SW_COMM CONTROL_SIGNALS --> SW_PERIPHERAL end %% High-Voltage Charging & Isolation subgraph "High-Voltage Charging & Isolation" CHARGER_INPUT["External Charger Input
48V-100VDC"] --> INPUT_PROTECTION["Input Protection
TVS, Fuse, Filter"] INPUT_PROTECTION --> CHARGING_CIRCUIT["Charging Management Circuit"] subgraph "Charging Switch & Control" Q_CHARGE["VBGQF1208N
N-Channel 200V/18A"] CHARGE_CONTROLLER["Charging Controller
BMS Interface"] end CHARGING_CIRCUIT --> Q_CHARGE CHARGE_CONTROLLER --> Q_CHARGE_GATE["Gate Driver"] Q_CHARGE_GATE --> Q_CHARGE Q_CHARGE --> CHARGE_BUS["Charging Bus"] CHARGE_BUS --> BATTERY_MANAGEMENT["Battery Management System
Cell Balancing, Monitoring"] BATTERY_MANAGEMENT --> BATTERY subgraph "Isolation Circuits" ISOLATION_SWITCH["Isolation Switch
Safety Critical Systems"] ISOLATION_GATE["Isolation Gate Driver"] end MAIN_BUS --> ISOLATION_SWITCH ISOLATION_GATE --> ISOLATION_SWITCH SAFETY_MCU["Safety MCU"] --> ISOLATION_GATE end %% Thermal Management System subgraph "Three-Level Thermal Management" subgraph "Level 1: Primary Heat Sources" COOLING_MOTOR["PCB Heatsink + Thermal Vias
Motor Drive MOSFETs"] COOLING_MOTOR --> Q_HIGH1 COOLING_MOTOR --> Q_HIGH2 end subgraph "Level 2: Secondary Heat Sources" COOLING_CHARGE["Thermal Pad + Vias
Charging Circuit MOSFET"] COOLING_CHARGE --> Q_CHARGE end subgraph "Level 3: Tertiary Heat Sources" COOLING_DIST["Natural Convection
Distribution Switches"] COOLING_DIST --> SW_SENSORS COOLING_DIST --> SW_COMPUTE end TEMP_SENSORS["Temperature Sensors
NTC/Thermistor"] --> PMIC PMIC --> FAN_CONTROL["Fan/Pump Control
PWM Output"] FAN_CONTROL --> ACTIVE_COOLING["Active Cooling System
Fans, Heat Pipes"] end %% System Monitoring & Communication subgraph "System Monitoring & Communication" PMIC --> SYSTEM_MONITOR["System Health Monitor"] SYSTEM_MONITOR --> FAULT_DETECTION["Fault Detection Circuits
OCP, OTP, UVP"] SYSTEM_MONITOR --> DIAGNOSTICS["Diagnostics Interface"] MAIN_MCU["Main System MCU"] --> COMMUNICATION_BUS["Communication Bus"] COMMUNICATION_BUS --> CAN_BUS["CAN Bus
Vehicle/System Interface"] COMMUNICATION_BUS --> CLOUD_CONNECT["Cloud Connectivity
Remote Monitoring"] DIAGNOSTICS --> MAIN_MCU end %% Style Definitions for Visual Differentiation style Q_HIGH1 fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style SW_SENSORS fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style Q_CHARGE fill:#fff3e0,stroke:#ff9800,stroke-width:2px style PMIC fill:#fce4ec,stroke:#e91e63,stroke-width:2px

The advent of AI-powered medical and wellness robots represents a paradigm shift in proactive healthcare and assisted living. These sophisticated mobile platforms integrate sensitive sensors, powerful computation, precise actuators, and safety-critical systems, all demanding a reliable, efficient, and intelligent power delivery network. The core performance—extended battery life, smooth and quiet motion, stable sensor operation, and robust safety features—hinges on a meticulously designed power management chain. This article adopts a holistic, system-level design philosophy to address the core challenge: selecting optimal power MOSFETs for key nodes within the compact, safety-conscious, and efficiency-driven confines of a care robot. We focus on three critical areas: high-current motor drive for mobility, intelligent multi-channel low-voltage power distribution, and robust high-voltage isolation/charging interfaces.
I. In-Depth Analysis of the Selected Device Combination and Application Roles
1. The Mobility Enabler: VBQF2207 (-20V, -52A, DFN8 3x3) – Main Drive Motor H-Bridge Switch
Core Positioning & Topology Deep Dive: This single P-Channel MOSFET, with an ultra-low Rds(on) of 4mΩ @10V, is engineered for the high-current, low-voltage brushed or brushless DC motor drive circuits in the robot's wheel or articulation actuators. Its exceptionally low conduction loss is paramount for maximizing operational time from a limited battery pack and minimizing heat generation in compact joints.
Key Technical Parameter Analysis:
Ultra-Low Loss & Power Density: The combination of sub-5mΩ resistance and a compact DFN8 (3x3) package is ideal for space-constrained motor drivers. It enables high torque output with minimal voltage drop, crucial for smooth starts, stops, and overcoming obstacles.
Safe Operation Area (SOA) for Transients: The high current rating (52A) ensures ample margin for handling stall currents and acceleration transients safely, a common scenario in assistive robots during interaction or navigation.
P-Channel for Simplified High-Side Drive: In H-bridge or half-bridge configurations for voltage control, using it on the high side simplifies gate drive compared to N-Channel, as it can be turned on by pulling the gate below the source, often eliminating the need for a bootstrap circuit in battery-powered applications.
2. The Intelligent Power Distributor: VBC6P2216 (Dual -20V, -7.5A, TSSOP8) – Multi-Rail Auxiliary System Power Switch
Core Positioning & System Integration Advantage: This dual P-Channel MOSFET in a TSSOP8 package is the cornerstone for intelligent, protected power distribution to various sub-systems such as sensor arrays (LiDAR, cameras), computing units (SoC, GPU), communication modules, and peripheral actuators (gripper, display). Its dual integration allows independent control of two critical power rails.
Key Technical Parameter Analysis:
Space-Efficient Control: The dual configuration in a small footprint saves over 60% PCB area compared to discrete solutions, critical for the densely packed interior of a mobile robot.
Logic-Level Control & Low Loss: With Rds(on) of 13mΩ @10V, it offers low conduction loss for rails drawing up to several amps. The -1.2V typical Vth allows direct control from low-voltage microcontrollers (3.3V/5V), enabling digital enable/disable, soft-start via PWM, and sequential power-up.
Safety and Diagnostics: It facilitates in-rush current limiting, load disconnect during faults, and can be used for redundant power path switching, enhancing overall system reliability and diagnostic capability.
3. The High-Voltage Interface Guardian: VBGQF1208N (200V, 18A, DFN8 3x3) – Charging/Isolation Circuit Switch
Core Positioning & System Benefit: This 200V N-Channel MOSFET, built on SGT (Shielded Gate Trench) technology, serves as the primary switch in the robot's charging management circuit (e.g., DC-DC converter for battery charging from an external adapter) or in isolation circuits for safety-critical systems. Its 200V rating provides a safety margin for 48V-100V charging systems.
Key Technical Parameter Analysis:
Balanced Performance for Medium Frequency: The SGT technology offers an excellent balance between low Rds(on) (66mΩ @10V) and switching performance. This is optimal for switching frequencies typical in charging circuits (tens to low hundreds of kHz), ensuring efficient power conversion with manageable EMI.
Robustness for External Interfaces: The voltage rating guards against surges from external power sources. Its compact DFN package allows integration into onboard charging modules without sacrificing power handling capability.
Efficiency in Power Conversion: Low conduction and switching losses directly contribute to cooler operation and faster, more efficient charging cycles, extending overall battery lifecycle.
II. System Integration Design and Expanded Key Considerations
1. Drive, Control, and System Awareness
Precision Motor Control: The VBQF2207 must be driven by dedicated motor driver ICs capable of high-current sourcing/sinking for fast switching, ensuring smooth PWM control and minimal audible noise—a critical factor in patient environments.
Digital Power Management Bus: The gates of VBC6P2216 channels should be controlled by the central management microcontroller or a dedicated PMIC, integrating with system health monitoring to shed non-critical loads during low battery conditions.
Charging Protocol Integration: The switching of VBGQF1208N must be synchronized with the battery management system (BMS) and charging controller to implement correct constant-current/constant-voltage (CC/CV) profiles and ensure safe hot-plug operation.
2. Hierarchical Thermal Management Strategy
Primary Heat Source (PCB Heatsink): The VBQF2207 in motor drives will require a thermal connection to the PCB's internal ground plane or a dedicated copper pour acting as a heatsink. For continuous high-load operation, thermal vias to a backside aluminum baseplate may be necessary.
Secondary Heat Source (PCB Conduction): The VBGQF1208N in the charging circuit should be placed on a generous thermal pad with multiple vias to dissipate heat during charging operations.
Tertiary Heat Source (Natural Convection): The VBC6P2216, typically switching lower average currents, can rely on natural convection and the PCB's copper traces for heat dissipation, given proper derating.
3. Engineering Details for Reliability and Safety Reinforcement
Electrical Stress Protection:
Motor Inductive Kickback: Robust snubber circuits or TVS diodes are mandatory across motor terminals driven by VBQF2207 to clamp voltage spikes from winding inductance.
Load Transients: Outputs of VBC6P2216 powering inductive loads (small motors, solenoids) require freewheeling diodes.
Charging Port Protection: The input stage using VBGQF1208N should include input capacitance and transient voltage suppression to handle external ESD and surges.
Gate Protection & Integrity: All gate drives should be optimized with series resistors. Gate-source Zener clamps (e.g., ±12V or ±15V) are essential, especially for the high-side P-Channel devices (VBQF2207, VBC6P2216), to prevent VGS overshoot.
Derating Practice:
Voltage Derating: Ensure VDS stress on VBGQF1208N remains below 160V (80% of 200V) under worst-case input conditions. For VBQF2207 and VBC6P2216, margin above the battery's maximum voltage (e.g., 16.8V for 4S Li-ion) is required.
Current & Thermal Derating: Base all continuous current ratings on the expected junction temperature in the end application, targeting Tj < 100°C for medical-grade reliability. Use transient thermal impedance curves to validate performance during short peak loads.
III. Quantifiable Perspective on Scheme Advantages
Quantifiable Efficiency & Runtime Gain: Utilizing VBQF2207 with 4mΩ Rds(on) versus a typical 10mΩ MOSFET in a 10A motor drive can reduce conduction loss by over 60% (P=I²R). This directly translates to extended operational time per charge or allows for the use of a smaller, lighter battery pack.
Quantifiable Space Saving & Reliability: Integrating dual power switches with VBC6P2216 saves critical PCB area in the core controller, reducing interconnection complexity and potential failure points, thereby increasing the Mean Time Between Failures (MTBF) of the power distribution network.
System Cost Optimization: Selecting application-optimized devices like the SGT-based VBGQF1208N for the charging circuit provides the necessary performance without the premium cost of wide-bandgap (GaN) solutions, achieving an optimal balance of efficiency, safety, and cost for this specific function.
IV. Summary and Forward Look
This selection provides a cohesive power chain for AI medical and wellness robots, addressing high-current propulsion, intelligent auxiliary power routing, and safe high-voltage interfacing. The philosophy is "right-sizing for the application":
Mobility Level – Focus on "Ultra-Efficiency & Power Density": Deploy ultra-low Rds(on) MOSFETs in minimal packages to maximize drive efficiency and save space.
Power Management Level – Focus on "Intelligent Integration & Control": Use integrated multi-channel switches to enable digital power management, sequencing, and protection.
Interface Level – Focus on "Robustness & Safety": Select devices with appropriate voltage margins and technology (SGT) for reliable and efficient operation in safety-critical interfaces like charging.
Future Evolution Directions:
Integrated Motor Drivers: Migration towards smart motor driver ICs that integrate gate drivers, protection, and current sensing with the power MOSFETs (like VBQF2207) for further size reduction and enhanced diagnostics.
Wide-Bandgap for Ultra-Fast Charging: For robots requiring rapid charge capability, GaN FETs could be considered in the primary side of the charging converter to achieve higher frequencies and smaller magnetic components.
Advanced Power Management ICs (PMICs): Increased use of system-specific PMICs that integrate multiple LDOs/DCDC converters with digital control, potentially interfacing directly with switches like VBC6P2216 for comprehensive power state management.
By applying this framework and tailoring it to specific robot parameters—battery voltage (e.g., 24V, 48V), peak motor current, sensor load inventory, and safety standards—engineers can develop power systems that are compact, efficient, intelligent, and utterly reliable for the demanding environment of AI-assisted care.

Detailed Topology Diagrams

High-Current Motor Drive H-Bridge Topology Detail

graph LR subgraph "H-Bridge Motor Driver Circuit" V_BAT["Battery Voltage
24V/48V"] --> H_BRIDGE_POWER["H-Bridge Power Stage"] subgraph "High-Side Switches (P-Channel)" HS1["VBQF2207
P-Channel MOSFET
-20V/-52A/4mΩ"] HS2["VBQF2207
P-Channel MOSFET
-20V/-52A/4mΩ"] end subgraph "Low-Side Switches (N-Channel)" LS1["N-Channel MOSFET
Synchronized Switching"] LS2["N-Channel MOSFET
Synchronized Switching"] end H_BRIDGE_POWER --> HS1 H_BRIDGE_POWER --> HS2 H_BRIDGE_POWER --> LS1 H_BRIDGE_POWER --> LS2 HS1 --> MOTOR_A["Motor Terminal A"] HS2 --> MOTOR_B["Motor Terminal B"] LS1 --> GND1["Ground"] LS2 --> GND2["Ground"] MOTOR_A --> DC_MOTOR["DC Motor Load"] MOTOR_B --> DC_MOTOR subgraph "Gate Drive & Control" DRIVER_IC["Motor Driver IC"] DRIVER_IC --> GATE_DRIVE_HIGH["High-Side Gate Driver"] DRIVER_IC --> GATE_DRIVE_LOW["Low-Side Gate Driver"] GATE_DRIVE_HIGH --> HS1 GATE_DRIVE_HIGH --> HS2 GATE_DRIVE_LOW --> LS1 GATE_DRIVE_LOW --> LS2 end subgraph "Protection & Sensing" TVS_ARRAY["TVS Diode Array
Inductive Kickback Clamping"] SHUNT_RES["Current Sense Shunt
High-Precision"] SHUNT_RES --> CURRENT_AMP["Current Amplifier"] CURRENT_AMP --> DRIVER_IC end DC_MOTOR --> TVS_ARRAY end subgraph "Thermal Management" THERMAL_PAD["Thermal Pad Interface"] THERMAL_VIAS["Thermal Vias to Ground Plane"] HS1 --> THERMAL_PAD HS2 --> THERMAL_PAD THERMAL_PAD --> THERMAL_VIAS THERMAL_VIAS --> PCB_HEATSINK["PCB Heatsink Area"] end style HS1 fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style HS2 fill:#e8f5e8,stroke:#4caf50,stroke-width:2px

Intelligent Power Distribution Topology Detail

graph LR subgraph "Multi-Channel Power Switch Array" VCC_IN["Distribution Bus
5V/12V"] --> CHANNEL_INPUT["Switch Array Input"] subgraph "Dual P-Channel Switch ICs" IC1["VBC6P2216
Dual P-Channel MOSFET
-20V/-7.5A"] IC2["VBC6P2216
Dual P-Channel MOSFET
-20V/-7.5A"] end CHANNEL_INPUT --> IC1 CHANNEL_INPUT --> IC2 subgraph "Channel 1: Sensor Power" IC1_CH1["Channel 1"] IC1_CH1 --> SENSOR_PWR["Sensor Array Power
LiDAR, Cameras, IMU"] end subgraph "Channel 2: Compute Power" IC1_CH2["Channel 2"] IC1_CH2 --> COMPUTE_PWR["Compute Unit Power
SoC, GPU, FPGA"] end subgraph "Channel 3: Communication Power" IC2_CH1["Channel 1"] IC2_CH1 --> COMM_PWR["Communication Power
WiFi, 5G, Bluetooth"] end subgraph "Channel 4: Peripheral Power" IC2_CH2["Channel 2"] IC2_CH2 --> PERIPH_PWR["Peripheral Power
Display, Audio, Gripper"] end SENSOR_PWR --> SENSOR_LOAD COMPUTE_PWR --> COMPUTE_LOAD COMM_PWR --> COMM_LOAD PERIPH_PWR --> PERIPHERAL_LOAD end subgraph "Digital Control Interface" MCU_GPIO["MCU GPIO Control Pins"] --> LEVEL_SHIFTER["Level Shifter Circuit"] LEVEL_SHIFTER --> GATE_CONTROL["Gate Control Signals"] GATE_CONTROL --> IC1_GATE1["IC1 Gate 1"] GATE_CONTROL --> IC1_GATE2["IC1 Gate 2"] GATE_CONTROL --> IC2_GATE1["IC2 Gate 1"] GATE_CONTROL --> IC2_GATE2["IC2 Gate 2"] IC1_GATE1 --> IC1_CH1 IC1_GATE2 --> IC1_CH2 IC2_GATE1 --> IC2_CH1 IC2_GATE2 --> IC2_CH2 end subgraph "Load Protection & Monitoring" IN_RUSH["In-Rush Current Limiting"] LOAD_DISCONNECT["Load Disconnect on Fault"] CURRENT_MON["Current Monitoring per Channel"] IC1_CH1 --> IN_RUSH IC1_CH2 --> IN_RUSH IC2_CH1 --> IN_RUSH IC2_CH2 --> IN_RUSH CURRENT_MON --> MCU_ADC["MCU ADC Inputs"] MCU_ADC --> FAULT_HANDLER["Fault Handler Routine"] FAULT_HANDLER --> LOAD_DISCONNECT end subgraph "Thermal Management" NATURAL_CONVECTION["Natural Convection Cooling"] PCB_TRACE["PCB Copper Trace Heat Spreading"] IC1 --> NATURAL_CONVECTION IC2 --> NATURAL_CONVECTION NATURAL_CONVECTION --> PCB_TRACE end style IC1 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style IC2 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px

High-Voltage Charging & Isolation Topology Detail

graph LR subgraph "Charging Circuit Power Stage" V_IN["External Charger Input
48V-100VDC"] --> INPUT_FILTER["Input Filter & Protection"] INPUT_FILTER --> DCDC_CONVERTER["DC-DC Converter Stage"] subgraph "Primary Switching Element" Q_PRIMARY["VBGQF1208N
N-Channel MOSFET
200V/18A/66mΩ"] end DCDC_CONVERTER --> Q_PRIMARY Q_PRIMARY --> TRANSFORMER["High-Frequency Transformer
Isolated Topology"] TRANSFORMER --> RECTIFIER["Secondary Rectification"] RECTIFIER --> CHARGE_OUTPUT["Charging Output"] CHARGE_OUTPUT --> BATTERY_PACK["Battery Pack"] subgraph "Control & Regulation" CHARGE_CONTROLLER["Charging Controller IC"] CHARGE_CONTROLLER --> PWM_GEN["PWM Generation"] PWM_GEN --> GATE_DRIVER["Gate Driver Circuit"] GATE_DRIVER --> Q_PRIMARY_GATE["Q Primary Gate"] Q_PRIMARY_GATE --> Q_PRIMARY end BATTERY_PACK --> BMS["Battery Management System"] BMS --> FEEDBACK["Voltage/Current Feedback"] FEEDBACK --> CHARGE_CONTROLLER end subgraph "Safety Isolation Switch" MAIN_POWER["Main Power Bus"] --> ISO_SWITCH["Isolation Switch"] subgraph "Isolation MOSFET" Q_ISO["High-Voltage MOSFET
Safety Critical Path"] end ISO_SWITCH --> Q_ISO Q_ISO --> SAFETY_LOAD["Safety Critical Loads
Emergency Systems"] subgraph "Isolation Control" SAFETY_MCU["Safety MCU"] --> ISO_DRIVER["Isolated Gate Driver"] ISO_DRIVER --> Q_ISO_GATE["Q ISO Gate"] Q_ISO_GATE --> Q_ISO end end subgraph "Protection Circuits" subgraph "Input Protection" TVS_IN["TVS Diode Array
Voltage Clamping"] FUSE["Polyfuse/PPTC
Overcurrent Protection"] CAP_INPUT["Input Capacitors
Bulk & High-Frequency"] end V_IN --> TVS_IN V_IN --> FUSE FUSE --> CAP_INPUT CAP_INPUT --> INPUT_FILTER end subgraph "Thermal Management" THERMAL_INTERFACE["Thermal Interface Material"] THERMAL_VIAS_ARRAY["Thermal Via Array"] HEATSINK["External Heatsink
(if required)"] Q_PRIMARY --> THERMAL_INTERFACE THERMAL_INTERFACE --> THERMAL_VIAS_ARRAY THERMAL_VIAS_ARRAY --> HEATSINK end subgraph "Communication Interface" CHARGE_CONTROLLER --> COMM_PROTOCOL["Charging Protocol
I2C/SPI/CAN"] COMM_PROTOCOL --> SYSTEM_MCU["System Main MCU"] SYSTEM_MCU --> STATUS_INDICATORS["Status Indicators
LEDs/Display"] end style Q_PRIMARY fill:#fff3e0,stroke:#ff9800,stroke-width:2px
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