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Power MOSFET/IGBT Selection Solution for Chemical Low-Altitude Transport eVTOL – Design Guide for High-Power, High-Reliability, and Lightweight Propulsion Systems
Chemical Transport eVTOL Power Semiconductor Topology Diagrams

Chemical Transport eVTOL Power System Overall Topology Diagram

graph LR %% High-Voltage Power Source subgraph "High-Voltage Battery System" BATTERY_PACK["High-Voltage Battery Pack
400-800VDC"] --> BATTERY_MGMT["Battery Management System"] BATTERY_PACK --> DC_LINK["DC-Link Capacitor Bank"] end %% Main Propulsion System subgraph "Main Propulsion Motor Drives (x4)" DC_LINK --> INV1["Motor Inverter #1"] DC_LINK --> INV2["Motor Inverter #2"] DC_LINK --> INV3["Motor Inverter #3"] DC_LINK --> INV4["Motor Inverter #4"] subgraph "Power Stage - VBP17R47S Array" MOSFET1["VBP17R47S
700V/47A"] MOSFET2["VBP17R47S
700V/47A"] MOSFET3["VBP17R47S
700V/47A"] MOSFET4["VBP17R47S
700V/47A"] MOSFET5["VBP17R47S
700V/47A"] MOSFET6["VBP17R47S
700V/47A"] end INV1 --> MOSFET1 INV1 --> MOSFET2 INV2 --> MOSFET3 INV2 --> MOSFET4 INV3 --> MOSFET5 INV3 --> MOSFET6 MOSFET1 --> MOTOR1["Propulsion Motor #1"] MOSFET2 --> MOTOR1 MOSFET3 --> MOTOR2["Propulsion Motor #2"] MOSFET4 --> MOTOR2 MOSFET5 --> MOTOR3["Propulsion Motor #3"] MOSFET6 --> MOTOR4["Propulsion Motor #4"] subgraph "Motor Control & Gate Driving" MOTOR_CTRL["Motor Controller (MCU/DSP)"] --> GATE_DRIVER["High-Current Gate Driver"] GATE_DRIVER --> MOSFET1 GATE_DRIVER --> MOSFET2 GATE_DRIVER --> MOSFET3 GATE_DRIVER --> MOSFET4 GATE_DRIVER --> MOSFET5 GATE_DRIVER --> MOSFET6 end end %% High-Power Auxiliary Systems subgraph "High-Power Auxiliary Loads" subgraph "Chemical Pump Drive" PUMP_CTRL["Pump Controller"] --> IGBT_DRIVER["IGBT Gate Driver"] IGBT_DRIVER --> IGBT1["VBMB16I20
600V/20A IGBT"] DC_LINK --> IGBT1 IGBT1 --> CHEM_PUMP["Chemical Transfer Pump"] end subgraph "Environmental Control System" ECS_CTRL["ECS Controller"] --> IGBT2["VBMB16I20
600V/20A IGBT"] DC_LINK --> IGBT2 IGBT2 --> COMPRESSOR["Air Compressor"] IGBT2 --> COOLING_PUMP["Coolant Pump"] end end %% Low-Voltage Distribution & Safety Systems subgraph "Critical Safety & Power Distribution" subgraph "Auxiliary Power Supply" AUX_PSU["DC-DC Converter
HV to 48V/12V"] --> DIST_BUS["Distribution Bus"] end subgraph "Solid-State Power Switches" SSR1["VBFB1102N
100V/50A"] --> BATTERY_DISCONNECT["Battery Disconnect Unit"] SSR2["VBFB1102N
100V/50A"] --> FAN_CONTROL["Cooling Fan Control"] SSR3["VBFB1102N
100V/50A"] --> HEATER_CONTROL["Cabin Heater"] SSR4["VBFB1102N
100V/50A"] --> AVIONICS_PWR["Avionics Power"] DIST_BUS --> SSR1 DIST_BUS --> SSR2 DIST_BUS --> SSR3 DIST_BUS --> SSR4 end subgraph "Safety Control" SAFETY_MCU["Safety MCU"] --> SSR1 SAFETY_MCU --> SSR2 SAFETY_MCU --> SSR3 SAFETY_MCU --> SSR4 end end %% Protection & Monitoring subgraph "System Protection & Monitoring" subgraph "Electrical Protection" TVS_ARRAY["TVS Surge Protection"] --> DC_LINK SNUBBER1["RC Snubber Network"] --> MOSFET1 SNUBBER2["RCD Clamp Circuit"] --> IGBT1 CURRENT_SENSE["High-Precision Current Sensors"] --> MOTOR_CTRL CURRENT_SENSE --> SAFETY_MCU end subgraph "Thermal Management" TEMP_SENSORS["NTC Temperature Sensors"] --> THERMAL_MGMT["Thermal Management Controller"] THERMAL_MGMT --> LIQUID_COOLING["Liquid Cooling System"] THERMAL_MGMT --> FANS["Forced Air Cooling"] LIQUID_COOLING --> MOSFET1 LIQUID_COOLING --> IGBT1 FANS --> VBFB1102N end subgraph "Fault Detection" DESAT_PROT["DESAT Protection"] --> GATE_DRIVER UVLO["Undervoltage Lockout"] --> GATE_DRIVER OCP["Overcurrent Protection"] --> SAFETY_MCU OTP["Overtemperature Protection"] --> THERMAL_MGMT end end %% Communication & Control subgraph "Vehicle Control & Communication" FLIGHT_CONTROLLER["Flight Controller"] --> MOTOR_CTRL FLIGHT_CONTROLLER --> PUMP_CTRL FLIGHT_CONTROLLER --> SAFETY_MCU CAN_BUS["Vehicle CAN Bus"] --> FLIGHT_CONTROLLER CAN_BUS --> BATTERY_MGMT TELEMETRY["Telemetry System"] --> FLIGHT_CONTROLLER end %% Style Definitions style MOSFET1 fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style IGBT1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style SSR1 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style MOTOR_CTRL fill:#fce4ec,stroke:#e91e63,stroke-width:2px style SAFETY_MCU fill:#f3e5f5,stroke:#9c27b0,stroke-width:2px

The rapid development of urban air mobility and specialized logistics, such as chemical transport, places extreme demands on electric Vertical Take-Off and Landing (eVTOL) aircraft. Their propulsion and power management systems, serving as the core of thrust generation and energy distribution, directly determine the aircraft's payload capacity, flight endurance, operational safety, and overall reliability. Power semiconductors (MOSFETs/IGBTs), as the critical switching components in these high-power systems, profoundly impact system efficiency, power density, thermal performance, and ruggedness through their selection. Addressing the unique requirements of high-voltage bus systems, stringent safety standards, and demanding weight constraints in chemical transport eVTOLs, this article proposes a complete, actionable semiconductor selection and design implementation plan with a scenario-oriented and systematic approach.
I. Overall Selection Principles: High Voltage, High Efficiency, and Robustness
Selection must prioritize a balance among voltage rating, conduction/switching losses, current handling, and package thermal performance, tailored to the rigorous aviation environment.
Voltage and Current Margin Design: Based on typical high-voltage bus architectures (e.g., 400V, 600V, 800V), select devices with a voltage rating margin ≥30-50% above the maximum bus voltage to withstand regenerative braking spikes and transients. Current rating must support continuous and peak thrust demands with significant derating for thermal management.
Loss Minimization for Range and Cooling: For motor drives, low conduction loss (low Rds(on) for MOSFETs, low VCEsat for IGBTs) is critical for efficiency. For high-switching-frequency applications (auxiliaries), low gate charge (Q_g) and output capacitance (Coss) are key to reducing switching loss and enabling higher frequencies.
Package and Thermal Management Coordination: High-power propulsion requires packages with very low thermal resistance (e.g., TO-247, TO-3P) for effective heatsinking. Weight-saving and space-constrained areas may use TO-220F or TO-252. Thermal interface materials and advanced cooling techniques (liquid cold plates) are often necessary.
Reliability and Environmental Ruggedness: Operation in varying atmospheric conditions and under continuous high stress demands devices with high junction temperature ratings, strong avalanche energy capability, and stable parameters over lifetime. Safety-critical designs may require adherence to relevant automotive or aerospace quality standards.
II. Scenario-Specific Semiconductor Selection Strategies
The powertrain of a chemical transport eVTOL can be categorized into main propulsion motors, high-power auxiliary pumps/compressors, and critical safety & distribution loads.
Scenario 1: Main Propulsion Motor Drive (High-Power, High-Voltage)
This is the most demanding application, requiring maximum efficiency, high power density, and ultimate reliability for lift and cruise.
Recommended Model: VBP17R47S (Single-N MOSFET, 700V, 47A, TO-247)
Parameter Advantages:
Super-Junction (SJ_Multi-EPI) technology offers an excellent balance of high voltage (700V) and remarkably low on-resistance (80 mΩ @10V), minimizing conduction losses.
High current rating (47A) suits multi-phase motor drive legs in parallel configurations.
TO-247 package provides superior thermal dissipation capability for managing high power.
Scenario Value:
Enables high-efficiency motor drive inverters, directly extending flight range and payload capacity.
The high voltage rating provides headroom for 600V+ bus systems, enhancing system safety margin.
Design Notes:
Must be driven by high-current gate driver ICs with reinforced isolation.
Requires meticulous PCB layout with low-inductance power loops and strategic placement of DC-link capacitors.
Scenario 2: High-Power Auxiliary Loads (Chemical Pump/Compressor Control)
These loads (e.g., for cargo environment management) require robust switching, high continuous current, and good efficiency at slightly lower frequencies than main motors.
Recommended Model: VBMB16I20 (IGBT+FRD, 600/650V, 20A, TO-220F)
Parameter Advantages:
Field Stop (FS) IGBT technology offers low saturation voltage (VCEsat=1.65V @15V) at medium frequencies, ideal for switch-mode pump drives.
Integrated Fast Recovery Diode (FRD) simplifies design and improves reliability in inductive switching.
TO-220F package offers a good balance of power handling and mounting flexibility.
Scenario Value:
Provides a cost-effective and robust solution for controlling several-hundred-watt auxiliary motors or pumps.
IGBT characteristics are favorable for lower switching frequency drives, simplifying EMC filtering.
Design Notes:
Gate drive voltage must be adequately supplied (typically 15V) for optimal VCEsat.
Consider snubber circuits for managing voltage overshoot during turn-off.
Scenario 3: Critical Safety & Power Distribution Loads (Rapid Switching, Lower Voltage)
These include battery disconnect units, fan controllers, or heater controls that require fast switching, low loss, and high reliability, often on lower voltage rails (e.g., 48V, 100V).
Recommended Model: VBFB1102N (Single-N MOSFET, 100V, 50A, TO-251)
Parameter Advantages:
Extremely low on-resistance (19 mΩ @10V) using Trench technology, ensuring minimal voltage drop and power loss in conduction.
High continuous current (50A) in a compact TO-251 package, offering excellent power density.
Lower voltage rating (100V) is perfect for secondary power distribution networks.
Scenario Value:
Enables highly efficient, compact solid-state power switching modules for safety-critical load shedding or power routing.
Low Rds(on) reduces heat generation in confined spaces, improving system reliability.
Design Notes:
Can often be driven directly by MCUs or via simple driver stages due to standard gate threshold.
Ensure proper PCB copper area for heat dissipation despite the small package.
III. Key Implementation Points for System Design
Drive Circuit Optimization: Use isolated, high-speed gate drivers for main propulsion MOSFETs/IGBTs. Pay critical attention to gate resistance selection to balance switching speed and EMI. Implement advanced protection features (DESAT, short-circuit, undervoltage lockout).
Thermal Management Design: Employ liquid cooling or large forced-air heatsinks for main inverters using TO-247 devices. Use thermal vias and exposed pads effectively for surface-mount or TO-220 packages. Perform detailed thermal simulation under worst-case flight profiles.
EMC and Reliability Enhancement: Implement comprehensive DC-link filtering with film capacitors. Use RC snubbers or clamp circuits across power devices to suppress voltage spikes. Employ common-mode chokes and shielded cables to mitigate conducted EMI. Integrate redundant protection circuits (current sensing, temperature monitoring) for fault-tolerant operation.
IV. Solution Value and Expansion Recommendations
Core Value:
High-Efficiency Propulsion: The combination of low-loss SJ MOSFETs and optimized IGBTs maximizes powertrain efficiency, crucial for mission range.
Enhanced Safety & Reliability: Rugged devices suitable for high-voltage environments, combined with robust protection designs, ensure safe operation during chemical transport missions.
Optimized Power Density: Selection of devices with high current capability and compact packages contributes to overall system weight reduction.
Optimization and Adjustment Recommendations:
Higher Power Scaling: For larger eVTOLs, consider paralleling VBP17R47S devices or exploring higher-current module solutions.
Integration Upgrade: For auxiliary drives, consider intelligent power modules (IPMs) that integrate IGBTs, drivers, and protection.
Extreme Environment: For operation in wide temperature ranges or high vibration, specify devices screened for enhanced robustness or consider potting critical power modules.
Future Technology: Monitor the adoption of Silicon Carbide (SiC) MOSFETs for the main inverter to achieve even higher frequency, efficiency, and power density.
Conclusion
The selection of power semiconductors is a cornerstone in the design of high-performance, reliable eVTOL propulsion and power systems for demanding applications like chemical transport. The scenario-based selection and systematic design methodology proposed herein aim to achieve the optimal balance among power density, efficiency, safety, and ruggedness. As eVTOL technology matures, the adoption of wide-bandgap semiconductors like SiC will further push the boundaries of performance, supporting the next generation of efficient and safe low-altitude logistics platforms.

Detailed Topology Diagrams

Main Propulsion Motor Drive Topology Detail

graph LR subgraph "Three-Phase Inverter Bridge" DC_IN["High-Voltage DC Bus"] --> CAP_BANK["DC-Link Capacitors"] CAP_BANK --> PHASE_A["Phase A Leg"] CAP_BANK --> PHASE_B["Phase B Leg"] CAP_BANK --> PHASE_C["Phase C Leg"] subgraph "Power MOSFET Array" Q_AH["VBP17R47S
High-Side A"] Q_AL["VBP17R47S
Low-Side A"] Q_BH["VBP17R47S
High-Side B"] Q_BL["VBP17R47S
Low-Side B"] Q_CH["VBP17R47S
High-Side C"] Q_CL["VBP17R47S
Low-Side C"] end PHASE_A --> Q_AH PHASE_A --> Q_AL PHASE_B --> Q_BH PHASE_B --> Q_BL PHASE_C --> Q_CH PHASE_C --> Q_CL Q_AH --> MOTOR_A["Motor Phase A"] Q_AL --> GND Q_BH --> MOTOR_B["Motor Phase B"] Q_BL --> GND Q_CH --> MOTOR_C["Motor Phase C"] Q_CL --> GND MOTOR_A --> MOTOR_WINDING["BLDC/PMSM Motor"] MOTOR_B --> MOTOR_WINDING MOTOR_C --> MOTOR_WINDING end subgraph "Gate Drive & Control" CONTROLLER["Motor Controller"] --> GATE_DRIVER["Isolated Gate Driver"] GATE_DRIVER --> Q_AH GATE_DRIVER --> Q_AL GATE_DRIVER --> Q_BH GATE_DRIVER --> Q_BL GATE_DRIVER --> Q_CH GATE_DRIVER --> Q_CL subgraph "Protection Circuits" DESAT["DESAT Detection"] --> GATE_DRIVER UVLO["UVLO Protection"] --> GATE_DRIVER CURRENT_SENSE["Shunt Current Sensing"] --> CONTROLLER end end subgraph "Thermal Management" HEATSINK["Liquid-Cooled Heatsink"] --> Q_AH HEATSINK --> Q_BH HEATSINK --> Q_CH TEMP_SENSOR["Temperature Sensor"] --> CONTROLLER end style Q_AH fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style CONTROLLER fill:#fce4ec,stroke:#e91e63,stroke-width:2px

Auxiliary Pump/Compressor Drive Topology Detail

graph LR subgraph "Single-Phase IGBT Drive" DC_IN["High-Voltage DC Bus"] --> INPUT_FILTER["Input Filter"] INPUT_FILTER --> IGBT_Q1["VBMB16I20 IGBT"] subgraph "Gate Drive Circuit" PWM_CONTROLLER["PWM Controller"] --> DRIVER_IC["Gate Driver IC"] DRIVER_IC --> IGBT_Q1 end IGBT_Q1 --> INDUCTOR["Output Inductor"] INDUCTOR --> CAPACITOR["Output Capacitor"] CAPACITOR --> MOTOR_LOAD["Pump/Compressor Motor"] IGBT_Q1 --> FRD["Integrated Fast Recovery Diode"] FRD --> INPUT_FILTER end subgraph "Control & Protection" MCU["Auxiliary Controller"] --> PWM_CONTROLLER subgraph "Protection Features" OVERCURRENT["Overcurrent Protection"] --> DRIVER_IC OVERTEMP["Overtemperature Shutdown"] --> MCU SNUBBER["RC Snubber Network"] --> IGBT_Q1 end end subgraph "Thermal Management" AIR_COOLING["Forced Air Cooling"] --> IGBT_Q1 HEATSINK["Aluminum Heatsink"] --> IGBT_Q1 end style IGBT_Q1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style MCU fill:#f3e5f5,stroke:#9c27b0,stroke-width:2px

Power Distribution & Safety Switching Topology Detail

graph LR subgraph "Solid-State Power Switching Matrix" POWER_IN["48V Distribution Bus"] --> SWITCH_ARRAY["Switch Array"] subgraph "MOSFET Switch Channels" CH1["VBFB1102N
Channel 1"] CH2["VBFB1102N
Channel 2"] CH3["VBFB1102N
Channel 3"] CH4["VBFB1102N
Channel 4"] CH5["VBFB1102N
Channel 5"] CH6["VBFB1102N
Channel 6"] end SWITCH_ARRAY --> CH1 SWITCH_ARRAY --> CH2 SWITCH_ARRAY --> CH3 SWITCH_ARRAY --> CH4 SWITCH_ARRAY --> CH5 SWITCH_ARRAY --> CH6 CH1 --> LOAD1["Battery Disconnect"] CH2 --> LOAD2["Cooling Fans"] CH3 --> LOAD3["Cabin Heater"] CH4 --> LOAD4["Avionics"] CH5 --> LOAD5["Lighting"] CH6 --> LOAD6["Sensors"] end subgraph "Control & Monitoring" SAFETY_MCU["Safety MCU"] --> DRIVER["Low-Side Driver"] DRIVER --> CH1 DRIVER --> CH2 DRIVER --> CH3 DRIVER --> CH4 DRIVER --> CH5 DRIVER --> CH6 subgraph "Current & Temperature Monitoring" CURRENT_SENSE["Current Sense Amplifier"] --> SAFETY_MCU TEMP_MON["Temperature Monitor"] --> SAFETY_MCU end subgraph "Fault Protection" OVERCURRENT["Overcurrent Trip"] --> SAFETY_MCU SHORT_CIRCUIT["Short-Circuit Protection"] --> DRIVER end end subgraph "PCB Thermal Design" COPPER_POUR["Thermal Copper Pour"] --> CH1 COPPER_POUR --> CH2 COPPER_POUR --> CH3 COPPER_POUR --> CH4 COPPER_POUR --> CH5 COPPER_POUR --> CH6 end style CH1 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style SAFETY_MCU fill:#f3e5f5,stroke:#9c27b0,stroke-width:2px

Thermal Management & Protection Topology Detail

graph LR subgraph "Multi-Level Cooling Architecture" subgraph "Level 1: Liquid Cooling" LIQUID_PUMP["Coolant Pump"] --> COLD_PLATE["Cold Plate"] COLD_PLATE --> MOSFET_ARRAY["VBP17R47S MOSFETs"] COLD_PLATE --> IGBT_ARRAY["VBMB16I20 IGBTs"] RADIATOR["Radiator"] --> LIQUID_PUMP FAN1["Radiator Fan"] --> RADIATOR end subgraph "Level 2: Forced Air Cooling" FAN2["System Fans"] --> HEATSINK1["MOSFET Heatsinks"] FAN2 --> HEATSINK2["IGBT Heatsinks"] FAN_CONTROLLER["Fan Controller"] --> FAN1 FAN_CONTROLLER --> FAN2 end subgraph "Level 3: Natural Convection" PCB_DESIGN["PCB Thermal Design"] --> SMD_DEVICES["SMD Components"] THERMAL_VIAS["Thermal Vias"] --> COPPER_POUR["Copper Pour"] end end subgraph "Temperature Monitoring Network" subgraph "Sensor Placement" TEMP1["NTC on Cold Plate"] --> TEMP_MONITOR TEMP2["NTC on Heatsink"] --> TEMP_MONITOR TEMP3["NTC on PCB"] --> TEMP_MONITOR TEMP4["Ambient Sensor"] --> TEMP_MONITOR end TEMP_MONITOR["Temperature Monitor IC"] --> THERMAL_MCU["Thermal Management MCU"] THERMAL_MCU --> LIQUID_PUMP THERMAL_MCU --> FAN_CONTROLLER THERMAL_MCU --> SYSTEM_CTRL["System Controller"] end subgraph "Electrical Protection Network" subgraph "Voltage Protection" TVS1["TVS Diodes"] --> DC_BUS TVS2["Varistors"] --> AC_SIDES CLAMP["Voltage Clamp"] --> GATE_DRIVERS end subgraph "Current Protection" SHUNT["Current Shunts"] --> AMP["Current Amplifier"] AMP --> COMPARATOR["Comparator"] COMPARATOR --> FAULT["Fault Signal"] end subgraph "Transient Protection" SNUBBER1["RC Snubber"] --> MOSFETS SNUBBER2["RCD Snubber"] --> IGBTS end FAULT --> SYSTEM_CTRL end style MOSFET_ARRAY fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style IGBT_ARRAY fill:#fff3e0,stroke:#ff9800,stroke-width:2px style THERMAL_MCU fill:#f3e5f5,stroke:#9c27b0,stroke-width:2px
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