Security

Your present location > Home page > Security
Application Analysis Handbook: MOSFET Selection Strategy for High-Reliability, High-Efficiency Security Patrol Robots
Security Patrol Robot Power MOSFET System Topology Diagram

Security Patrol Robot Power MOSFET System Overall Topology Diagram

graph LR %% Power Source & Distribution subgraph "Power Source & Distribution System" BATTERY_PACK["Li-Ion Battery Pack
48V/72V/96V"] --> MAIN_POWER_SWITCH["Main Power Switch"] MAIN_POWER_SWITCH --> DC_BUS["Main DC Power Bus"] DC_BUS --> FUSE_ARRAY["Fuse Array Protection"] FUSE_ARRAY --> SUB_SYSTEMS["Sub-System Power Rails"] end %% Scenario 1: Traction & Drive Motor Control subgraph "Traction & Drive Motor Control (500W-2kW+)" TRACTION_CONTROLLER["Motor Controller
DSP/MCU"] --> GATE_DRIVER_SIC["SiC Gate Driver"] GATE_DRIVER_SIC --> VBP165C50_1["VBP165C50
650V/50A SiC N-MOS"] GATE_DRIVER_SIC --> VBP165C50_2["VBP165C50
650V/50A SiC N-MOS"] GATE_DRIVER_SIC --> VBP165C50_3["VBP165C50
650V/50A SiC N-MOS"] GATE_DRIVER_SIC --> VBP165C50_4["VBP165C50
650V/50A SiC N-MOS"] VBP165C50_1 --> TRACTION_MOTOR["Brushless DC Motor
Traction Drive"] VBP165C50_2 --> TRACTION_MOTOR VBP165C50_3 --> TRACTION_MOTOR VBP165C50_4 --> TRACTION_MOTOR TRACTION_MOTOR --> WHEELS["Robot Wheels"] end %% Scenario 2: Auxiliary Actuator & Sensor Power subgraph "Auxiliary Actuator & Sensor Power (10W-200W)" AUX_MCU["Auxiliary MCU"] --> PTZ_CONTROLLER["PTZ Camera Controller"] AUX_MCU --> ARM_JOINT_CONTROLLER["Robotic Arm Controller"] AUX_MCU --> LIDAR_CONTROLLER["LiDAR Motor Controller"] AUX_MCU --> FAN_CONTROLLER["Cooling Fan Controller"] PTZ_CONTROLLER --> VBA3316SD_1["VBA3316SD
30V Half-Bridge"] ARM_JOINT_CONTROLLER --> VBA3316SD_2["VBA3316SD
30V Half-Bridge"] LIDAR_CONTROLLER --> VBA3316SD_3["VBA3316SD
30V Half-Bridge"] FAN_CONTROLLER --> VBA3316SD_4["VBA3316SD
30V Half-Bridge"] VBA3316SD_1 --> PTZ_MOTOR["Pan-Tilt-Zoom Motor"] VBA3316SD_2 --> ARM_MOTOR["Robotic Arm Joint Motor"] VBA3316SD_3 --> LIDAR_MOTOR["LiDAR Rotation Motor"] VBA3316SD_4 --> COOLING_FAN["System Cooling Fan"] end %% Scenario 3: High-Voltage System Management subgraph "High-Voltage System Management & Safety" SAFETY_MCU["Safety MCU"] --> ISOLATION_DRIVER["Isolated Gate Driver"] ISOLATION_DRIVER --> VBGE1121N_1["VBGE1121N
120V/60A N-MOS"] ISOLATION_DRIVER --> VBGE1121N_2["VBGE1121N
120V/60A N-MOS"] VBGE1121N_1 --> ULTRASONIC_EMITTER["Ultrasonic Emitter"] VBGE1121N_2 --> COMMUNICATION_MODULE["High-Power Comms"] VBGE1121N_1 --> BATTERY_ISOLATION["Battery Isolation Switch"] end %% Protection & Monitoring subgraph "Protection & Monitoring Circuits" CURRENT_SENSORS["Current Sensors"] --> PROTECTION_IC["Protection IC"] VOLTAGE_MONITORS["Voltage Monitors"] --> PROTECTION_IC TEMPERATURE_SENSORS["Temperature Sensors"] --> PROTECTION_IC PROTECTION_IC --> FAULT_SIGNAL["Fault Signal Output"] FAULT_SIGNAL --> TRACTION_CONTROLLER FAULT_SIGNAL --> SAFETY_MCU TVS_ARRAY["TVS Array"] --> DC_BUS RC_SNUBBERS["RC Snubbers"] --> VBP165C50_1 RCD_SNUBBERS["RCD Snubbers"] --> VBGE1121N_1 end %% Thermal Management subgraph "Three-Level Thermal Management" LEVEL1["Level 1: Heatsink + Fan"] --> VBP165C50_1 LEVEL1 --> VBP165C50_2 LEVEL2["Level 2: PCB Copper + Vias"] --> VBGE1121N_1 LEVEL2 --> VBGE1121N_2 LEVEL3["Level 3: Natural Convection"] --> VBA3316SD_1 LEVEL3 --> VBA3316SD_2 TEMPERATURE_SENSORS --> THERMAL_MANAGER["Thermal Management MCU"] THERMAL_MANAGER --> FAN_SPEED["Fan Speed Control"] THERMAL_MANAGER --> POWER_THROTTLE["Power Throttle Control"] end %% Communication Network subgraph "Communication & Control Network" MAIN_CONTROLLER["Main Robot Controller"] --> CAN_BUS["CAN Bus Network"] CAN_BUS --> TRACTION_CONTROLLER CAN_BUS --> AUX_MCU CAN_BUS --> SAFETY_MCU CAN_BUS --> THERMAL_MANAGER MAIN_CONTROLLER --> WIRELESS_COMM["Wireless Communication"] WIRELESS_COMM --> CONTROL_CENTER["Remote Control Center"] end %% Style Definitions style VBP165C50_1 fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style VBA3316SD_1 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style VBGE1121N_1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style TRACTION_CONTROLLER fill:#fce4ec,stroke:#e91e63,stroke-width:2px

The increasing adoption of automation for facility management has propelled autonomous security robots to the forefront of perimeter and indoor surveillance. The mobility, sensor, and communication systems, acting as the "legs, eyes, and voice" of the robot, demand precise and reliable power delivery and motor control. The selection of power MOSFETs is critical in determining the system's operational endurance (battery life), torque response, thermal management, and overall reliability in harsh, variable environments. Addressing the stringent demands of patrol robots for long runtime, robust performance, compactness, and environmental resilience, this article develops a practical, scenario-optimized MOSFET selection strategy.
I. Core Selection Principles and Scenario Adaptation Logic
(A) Core Selection Principles: Four-Dimensional Optimization for Mobile Platforms
MOSFET selection requires a balanced optimization across four dimensions—voltage, loss, package, and reliability—ensuring a perfect match with the dynamic operating conditions of a mobile robot:
Ample Voltage Margin for Transients: For common robot DC bus voltages (24V, 48V, 72V, 96V), select devices with a rated voltage (Vds) exceeding the maximum bus voltage by 50-100% to handle regenerative braking spikes, inductive kickback, and unstable battery voltages during high-current draws.
Ultra-Low Loss for Maximum Endurance: Prioritize devices with extremely low Rds(on) to minimize conduction loss in motors and low Qg/Coss to reduce switching loss in high-frequency PWM drives. This directly translates to extended battery life and reduced thermal load in a confined space.
Package for Power Density and Ruggedness: Choose compact, low-thermal-resistance packages (e.g., TO247, TO263) for high-power traction drives. Select space-saving, thermally efficient packages (e.g., SOP8, TO252) for auxiliary systems to maximize internal layout space and withstand vibration.
Reliability for Demanding Duty Cycles: Meet requirements for continuous operation, shock/vibration resistance, and wide temperature ranges (-40°C to 125°C+). Focus on robust technology (SiC, Deep-Trench) and high junction temperature ratings for outdoor and 24/7 scenarios.
(B) Scenario Adaptation Logic: Categorization by Robotic Sub-System
Divide loads into three core operational scenarios: First, Traction & Drive Motor Control (mobility core), requiring high-current, high-efficiency, and bidirectional control. Second, Auxiliary Actuator & Sensor Power (functional limbs), requiring compact, integrated solutions for precise, low-power control. Third, High-Voltage System Management (safety & utility), requiring robust isolation and switching for auxiliary high-power loads or battery management.
II. Detailed MOSFET Selection Scheme by Scenario
(A) Scenario 1: Traction & Drive Motor Control (500W-2kW+) – Mobility Powerhouse
Traction motors must deliver high continuous torque and handle extreme peak currents during acceleration, slope climbing, or obstacle overcoming. Efficiency is paramount for range.
Recommended Model: VBP165C50 (Single N-MOS, 650V, 50A, TO247)
Parameter Advantages: Utilizes advanced SiC (Silicon Carbide) technology, offering an ultra-low Rds(on) of 40mΩ. The 650V rating provides a massive safety margin for 48V/72V/96V buses, especially during regenerative braking. The 50A continuous current (with high peak capability) suits medium to large drive systems. The TO247 package enables excellent heat dissipation.
Adaptation Value: SiC technology drastically reduces switching and conduction losses, increasing drive system efficiency to >98% in typical operating ranges. This significantly extends battery life. The high voltage rating ensures unparalleled robustness against voltage transients in mobile applications. Enables higher switching frequencies for smoother motor control and reduced audible noise.
Selection Notes: Verify motor phase current and battery voltage. Use with a dedicated motor driver IC or microcontroller gate driver capable of driving SiC MOSFETs. Careful PCB layout for high-speed switching loops is essential. A dedicated heatsink is highly recommended.
(B) Scenario 2: Auxiliary Actuator & Sensor Power (10W-200W) – Integrated Control Node
Auxiliary systems like pan-tilt-zoom (PTZ) camera gimbals, robotic arm joints, lidar motor drives, or fan controllers require compact, efficient, and often multi-channel switching solutions.
Recommended Model: VBA3316SD (Half-Bridge N+N, 30V, 6.8A/10A, SOP8)
Parameter Advantages: The SOP8 integrated half-bridge contains two matched N-MOSFETs, saving over 60% PCB area compared to discrete solutions. A low Vth of 1.7V allows direct drive from 3.3V/5V MCUs. Low Rds(on) (18mΩ @10V) minimizes loss. The 30V rating is ideal for 12V/24V auxiliary sub-systems.
Adaptation Value: Provides a complete, compact solution for driving small brushed DC motors, stepper motor coils, or acting as a synchronous buck converter switch. Simplifies design, reduces component count, and improves system reliability for multiple distributed control nodes.
Selection Notes: Ensure total power per channel remains within limits. A small gate resistor (e.g., 10Ω) is recommended on each input. Ensure adequate local copper pour for heat dissipation on the SOP8 package.
(C) Scenario 3: High-Voltage System Management – Safety & Utility Switch
This scenario covers robust switching for potentially higher voltage auxiliary systems (e.g., high-power ultrasonic emitters, communication gear) or as a main system power isolation switch, requiring reliable on/off control.
Recommended Model: VBGE1121N (Single N-MOS, 120V, 60A, TO252)
Parameter Advantages: Features SGT (Shielded Gate Trench) technology for an excellent balance of low Rds(on) (11.5mΩ @10V) and cost. The 120V rating is perfectly suited for 48V or 72V robot bus systems with >50% margin. High current rating (60A) provides ample headroom. The TO252 (D-PAK) package offers a good compromise between power handling and footprint.
Adaptation Value: An ideal, cost-effective high-side or low-side switch for main system power distribution, high-power accessory enable/disable, or as a robust switch in battery management circuits. Its low loss minimizes voltage drop and heating in power paths. Offers a more compact alternative to TO-220/TO-247 for high-current paths where space is constrained.
Selection Notes: Can be driven by a standard gate driver IC. For high-side switching, a bootstrap or isolated driver is needed. Requires a good PCB copper area for heat sinking. Consider parallel use for currents above 40A.
III. System-Level Design Implementation Points
(A) Drive Circuit Design: Matching Robotic Dynamics
VBP165C50 (SiC): Must be paired with a gate driver specifically characterized for SiC (negative turn-off voltage recommended, e.g., -3 to -5V). Use low-inductance PCB layouts and gate resistors to control di/dt and dv/dt.
VBA3316SD (Half-Bridge): Can be driven directly by many microcontroller PWM outputs. Include dead-time logic in firmware to prevent shoot-through. A small RC snubber across the motor terminals may be needed for EMI suppression.
VBGE1121N (SGT): Use a standard MOSFET driver with adequate current capability (e.g., 2A peak). A gate-source capacitor (1-10nF) can improve noise immunity in noisy robot environments.
(B) Thermal Management Design: Tiered for Mobility
VBP165C50: Primary focus. Attach to a dedicated aluminum heatsink, possibly coupled to the robot's chassis or a forced-air cooling system (internal fan). Use thermal interface material (TIM) of high quality.
VBGE1121N: Secondary focus. Ensure the PCB has a large, unbroken copper plane (minimum 500mm²) connected to the tab. Multiple thermal vias to internal ground planes are crucial. A small clip-on heatsink may be used if space allows.
VBA3316SD: Local dissipation. Ensure the SOP8 package has a reasonable copper pad underneath connected to a ground plane via thermal vias. General airflow within the robot enclosure is usually sufficient.
(C) EMC and Reliability Assurance for Harsh Environments
EMC Suppression:
Motor Drives (VBP165C50): Use twisted-pair/shielded cables for motor connections. Implement a pi-filter (inductor + X/Y capacitors) at the driver output. Place a high-frequency film capacitor (100nF) directly across the motor driver's DC bus inputs.
All Scenarios: Implement strict PCB zoning: separate high-power motor loops, digital control, and sensitive sensor (radio, camera) power domains. Use ferrite beads on all cable entry/exit points.
Reliability Protection:
Overcurrent/SOA Protection: Implement hardware-based desaturation detection for the main drive MOSFETs (VBP165C50). Use current shunt monitors or hall-effect sensors in motor phases.
Transient Protection: Place TVS diodes (e.g., SMCJ58A) at the main battery input terminals to clamp load-dump and ESD events. Use RC snubbers across inductive loads switched by VBGE1121N.
Redundancy & Monitoring: Design critical power paths (e.g., main system switch using VBGE1121N) with monitoring feedback to the main controller. Consider temperature sensors near high-power MOSFETs.
IV. Scheme Core Value and Optimization Suggestions
(A) Core Value
Maximized Operational Endurance: SiC and SGT-based selection drastically reduces system losses, directly extending mission time per charge or enabling the use of smaller, lighter battery packs.
Enhanced Robustness and Reliability: The selected devices offer high voltage margins and are housed in robust packages, ensuring stable operation under the shock, vibration, and thermal stress of mobile patrol duty.
Optimized Power Density: The combination of high-efficiency SiC/advanced trench devices and integrated half-bridge solutions allows for a more compact, lighter, and serviceable internal design, freeing space for more sensors or compute.
(B) Optimization Suggestions
Power & Voltage Scaling: For very large robots (>3kW traction), consider paralleling VBP165C50 devices or moving to a higher-current SiC module. For lower-cost robots with 24V/48V systems, VBGE1121N is an excellent primary drive device.
Integration for Compactness: Where multiple small actuators are needed, use multiple VBA3316SD devices. For main drive, investigate integrated power modules (IPMs) that combine MOSFETs and drivers if design resources are limited.
Specialized Environments: For robots operating in extreme cold, select variants with lower Vth. For high-vibration environments, ensure all MOSFETs are properly mechanically secured (adhesive, clips).
Future-Proofing: Monitor the development of GaN (Gallium Nitride) devices for potential efficiency gains in auxiliary DC-DC converters and motor drives at even higher frequencies.
Conclusion
Strategic MOSFET selection is fundamental to building high-performance, reliable, and enduring security patrol robots. This scenario-based methodology, focusing on traction drive efficiency, actuator integration, and system robustness, provides a clear roadmap for power design engineers. Future developments in wide-bandgap semiconductors and intelligent power stages will further push the boundaries of mobility, sensing, and operational autonomy in next-generation robotic security platforms.

Detailed MOSFET Application Topology Diagrams

Traction & Drive Motor Control Topology Detail (Scenario 1)

graph LR subgraph "Three-Phase BLDC Motor Drive Bridge" POWER_IN["DC Bus 48-96V"] --> PHASE_A_H["Phase A High Side"] POWER_IN --> PHASE_B_H["Phase B High Side"] POWER_IN --> PHASE_C_H["Phase C High Side"] PHASE_A_H --> MOSFET_A_H["VBP165C50
SiC N-MOS"] PHASE_B_H --> MOSFET_B_H["VBP165C50
SiC N-MOS"] PHASE_C_H --> MOSFET_C_H["VBP165C50
SiC N-MOS"] MOSFET_A_H --> PHASE_A_OUT["Phase A Output"] MOSFET_B_H --> PHASE_B_OUT["Phase B Output"] MOSFET_C_H --> PHASE_C_OUT["Phase C Output"] PHASE_A_OUT --> MOTOR_TERMINAL_A["Motor Phase A"] PHASE_B_OUT --> MOTOR_TERMINAL_B["Motor Phase B"] PHASE_C_OUT --> MOTOR_TERMINAL_C["Motor Phase C"] MOSFET_A_H --> CURRENT_SENSE_A["Phase Current Sense"] MOSFET_B_H --> CURRENT_SENSE_B["Phase Current Sense"] MOSFET_C_H --> CURRENT_SENSE_C["Phase Current Sense"] end subgraph "Gate Drive & Control Circuit" CONTROLLER["Motor Controller DSP"] --> GATE_DRIVER["SiC Gate Driver IC"] GATE_DRIVER --> GATE_A_H["Gate A High"] GATE_DRIVER --> GATE_B_H["Gate B High"] GATE_DRIVER --> GATE_C_H["Gate C High"] GATE_A_H --> MOSFET_A_H GATE_B_H --> MOSFET_B_H GATE_C_H --> MOSFET_C_H CURRENT_SENSE_A --> CONTROLLER CURRENT_SENSE_B --> CONTROLLER CURRENT_SENSE_C --> CONTROLLER end subgraph "Protection & Thermal Management" DESAT_DETECT["Desaturation Detection"] --> FAULT["Fault Output"] FAULT --> CONTROLLER TEMP_SENSOR["Temperature Sensor"] --> THERMAL_MON["Thermal Monitor"] THERMAL_MON --> CONTROLLER HEATSINK["Aluminum Heatsink"] --> MOSFET_A_H HEATSINK --> MOSFET_B_H HEATSINK --> MOSFET_C_H end style MOSFET_A_H fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style MOSFET_B_H fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style MOSFET_C_H fill:#e8f5e8,stroke:#4caf50,stroke-width:2px

Auxiliary Actuator & Sensor Power Topology Detail (Scenario 2)

graph LR subgraph "Half-Bridge Motor Drive Configuration" POWER_12V["12V Auxiliary Rail"] --> VCC["VBA3316SD VCC Pin"] VCC --> INTERNAL_LOGIC["Internal Logic"] INTERNAL_LOGIC --> HIGH_SIDE_GATE["High Side Gate Driver"] INTERNAL_LOGIC --> LOW_SIDE_GATE["Low Side Gate Driver"] HIGH_SIDE_GATE --> HIGH_SIDE_MOS["High Side N-MOS"] LOW_SIDE_GATE --> LOW_SIDE_MOS["Low Side N-MOS"] HIGH_SIDE_MOS --> OUTPUT["Half-Bridge Output"] LOW_SIDE_MOS --> GND["Ground"] OUTPUT --> MOTOR_TERMINAL["DC Motor Terminal"] MOTOR_TERMINAL --> BACK_EMF["Back-EMF Diode"] BACK_EMF --> POWER_12V end subgraph "MCU Direct Control Interface" MCU_GPIO["MCU GPIO Pin"] --> LEVEL_SHIFTER["3.3V to 5V Level Shifter"] LEVEL_SHIFTER --> INPUT_HI["High Side Input (INH)"] LEVEL_SHIFTER --> INPUT_LO["Low Side Input (INL)"] INPUT_HI --> INTERNAL_LOGIC INPUT_LO --> INTERNAL_LOGIC MCU_GPIO --> DEAD_TIME["Dead-Time Control"] DEAD_TIME --> INPUT_HI DEAD_TIME --> INPUT_LO end subgraph "Multi-Channel Application Example" MCU["Main Controller"] --> CHANNEL1["Channel 1 Control"] MCU --> CHANNEL2["Channel 2 Control"] MCU --> CHANNEL3["Channel 3 Control"] MCU --> CHANNEL4["Channel 4 Control"] CHANNEL1 --> VBA3316SD_1["VBA3316SD #1"] CHANNEL2 --> VBA3316SD_2["VBA3316SD #2"] CHANNEL3 --> VBA3316SD_3["VBA3316SD #3"] CHANNEL4 --> VBA3316SD_4["VBA3316SD #4"] VBA3316SD_1 --> PTZ_MOTOR["PTZ Camera Motor"] VBA3316SD_2 --> ARM_MOTOR["Robotic Arm Motor"] VBA3316SD_3 --> LIDAR_MOTOR["LiDAR Motor"] VBA3316SD_4 --> FAN_MOTOR["Cooling Fan"] end style VBA3316SD_1 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style VBA3316SD_2 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style VBA3316SD_3 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style VBA3316SD_4 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px

High-Voltage System Management Topology Detail (Scenario 3)

graph LR subgraph "High-Side Switch Configuration" BATTERY_POS["Battery Positive"] --> SOURCE_VBGE["VBGE1121N Source"] CONTROL_MCU["Safety MCU"] --> ISOLATED_DRIVER["Isolated Gate Driver"] ISOLATED_DRIVER --> GATE_VBGE["VBGE1121N Gate"] GATE_VBGE --> MOSFET_CHANNEL["MOSFET Channel"] SOURCE_VBGE --> MOSFET_CHANNEL MOSFET_CHANNEL --> DRAIN_VBGE["VBGE1121N Drain"] DRAIN_VBGE --> LOAD_POSITIVE["Load Positive Terminal"] LOAD_POSITIVE --> HIGH_POWER_LOAD["High-Power Load"] HIGH_POWER_LOAD --> BATTERY_NEG["Battery Negative"] end subgraph "Protection & Monitoring Circuits" CURRENT_SHUNT["Current Shunt Resistor"] --> AMPLIFIER["Current Sense Amplifier"] AMPLIFIER --> ADC["ADC Input"] ADC --> CONTROL_MCU VOLTAGE_DIVIDER["Voltage Divider"] --> ADC ADC --> CONTROL_MCU TEMP_SENSOR["Temperature Sensor"] --> CONTROL_MCU CONTROL_MCU --> OVERCURRENT["Over-Current Protection"] CONTROL_MCU --> OVERTEMP["Over-Temperature Protection"] CONTROL_MCU --> UNDERVOLT["Under-Voltage Protection"] OVERCURRENT --> FAULT_SIGNAL["Fault Signal"] OVERTEMP --> FAULT_SIGNAL UNDERVOLT --> FAULT_SIGNAL FAULT_SIGNAL --> ISOLATED_DRIVER end subgraph "PCB Layout & Thermal Design" MOSFET_PACKAGE["TO-252 Package"] --> COPPER_POUR["Large Copper Pour"] COPPER_POUR --> THERMAL_VIAS["Thermal Vias Array"] THERMAL_VIAS --> GROUND_PLANE["Internal Ground Plane"] COPPER_POUR --> HEATSINK_ATTACH["Heatsink Attachment Area"] HEATSINK_ATTACH --> CLIP_ON_HEATSINK["Clip-On Heatsink"] TEMP_SENSOR --> NEAR_MOSFET["Positioned Near MOSFET"] end subgraph "Application Examples" MAIN_POWER_SWITCH["Main Power Switch"] --> VBGE1121N_1["VBGE1121N"] BATTERY_ISOLATION["Battery Isolation"] --> VBGE1121N_2["VBGE1121N"] ACCESSORY_POWER["Accessory Power Enable"] --> VBGE1121N_3["VBGE1121N"] HIGH_POWER_COMMS["High-Power Comms Switch"] --> VBGE1121N_4["VBGE1121N"] end style VBGE1121N_1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style VBGE1121N_2 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style VBGE1121N_3 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style VBGE1121N_4 fill:#fff3e0,stroke:#ff9800,stroke-width:2px
Download PDF document
Download now:VBP165C50

Sample Req

Online

Telephone

400-655-8788

WeChat

Topping

Sample Req
Online
Telephone
WeChat