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MOSFET Selection Strategy and Device Adaptation Handbook for High-End Autonomous Forklifts with Demanding Efficiency and Reliability Requirements
High-End Autonomous Forklift MOSFET System Topology Diagram

High-End Autonomous Forklift System Overall Topology Diagram

graph LR %% Battery Input Section subgraph "High-Voltage Battery System" BATTERY_PACK["High-Voltage Battery Pack
96V/144V/400V"] --> BATTERY_MANAGEMENT["Battery Management System"] BATTERY_MANAGEMENT --> MAIN_DISCONNECT["Main Disconnect Relay"] end %% Main Power Stage - Traction Inverter subgraph "Main Traction Inverter - 3-Phase Bridge" MAIN_DISCONNECT --> DC_BUS["High-Voltage DC Bus"] DC_BUS --> PHASE_A_LOW["Phase A Low-Side"] DC_BUS --> PHASE_B_LOW["Phase B Low-Side"] DC_BUS --> PHASE_C_LOW["Phase C Low-Side"] subgraph "VBGP1102 MOSFET Array (TO247)" Q_A_HIGH["VBGP1102
100V/180A
Rds(on)=2.4mΩ"] Q_B_HIGH["VBGP1102
100V/180A
Rds(on)=2.4mΩ"] Q_C_HIGH["VBGP1102
100V/180A
Rds(on)=2.4mΩ"] Q_A_LOW["VBGP1102
100V/180A
Rds(on)=2.4mΩ"] Q_B_LOW["VBGP1102
100V/180A
Rds(on)=2.4mΩ"] Q_C_LOW["VBGP1102
100V/180A
Rds(on)=2.4mΩ"] end Q_A_HIGH --> MOTOR_A["Motor Phase A"] Q_B_HIGH --> MOTOR_B["Motor Phase B"] Q_C_HIGH --> MOTOR_C["Motor Phase C"] MOTOR_A --> Q_A_LOW MOTOR_B --> Q_B_LOW MOTOR_C --> Q_C_LOW Q_A_LOW --> PHASE_A_LOW Q_B_LOW --> PHASE_B_LOW Q_C_LOW --> PHASE_C_LOW end %% Auxiliary Power Distribution subgraph "Auxiliary Power Distribution System" DC_BUS --> DC_DC_CONVERTER["DC-DC Converter
(24V/12V)"] DC_DC_CONVERTER --> AUX_BUS["Auxiliary Power Bus
24V/12V"] subgraph "Power Distribution Switches - VBNCB1206" SW_SENSORS["VBNCB1206
20V/95A
Sensors"] SW_COMPUTING["VBNCB1206
20V/95A
Computing Unit"] SW_COMMS["VBNCB1206
20V/95A
Communications"] SW_LIGHTING["VBNCB1206
20V/95A
Lighting"] end AUX_BUS --> SW_SENSORS AUX_BUS --> SW_COMPUTING AUX_BUS --> SW_COMMS AUX_BUS --> SW_LIGHTING SW_SENSORS --> SENSOR_LOAD["Sensor Array"] SW_COMPUTING --> COMPUTING_LOAD["Computing Unit"] SW_COMMS --> COMMS_LOAD["Communication Modules"] SW_LIGHTING --> LIGHTING_LOAD["LED Lighting System"] end %% Safety Critical Systems subgraph "Safety-Critical Function Control" subgraph "Brake System - VBL2101N" BRAKE_CONTROLLER["Brake Controller"] --> GATE_DRIVER_BRAKE["Gate Driver"] GATE_DRIVER_BRAKE --> Q_BRAKE["VBL2101N
-100V/-100A
Rds(on)=11mΩ"] AUX_BUS --> Q_BRAKE Q_BRAKE --> BRAKE_COIL["Electromechanical Brake Coil"] BRAKE_COIL --> BRAKE_GND["Ground"] BRAKE_COIL --> FREEWHEEL_DIODE["Freewheeling Diode"] FREEWHEEL_DIODE --> Q_BRAKE end subgraph "Emergency Disconnect" EMERGENCY_SIGNAL["Emergency Signal"] --> GATE_DRIVER_ESD["Gate Driver"] GATE_DRIVER_ESD --> Q_ESD["VBL2101N
-100V/-100A
Emergency Disconnect"] DC_BUS --> Q_ESD Q_ESD --> LOAD_DISCONNECT["Load Disconnect Point"] end end %% Control & Monitoring System subgraph "Central Control System" MAIN_MCU["Main Control MCU"] --> GATE_DRIVER_INVERTER["3-Phase Gate Driver"] GATE_DRIVER_INVERTER --> Q_A_HIGH GATE_DRIVER_INVERTER --> Q_B_HIGH GATE_DRIVER_INVERTER --> Q_C_HIGH GATE_DRIVER_INVERTER --> Q_A_LOW GATE_DRIVER_INVERTER --> Q_B_LOW GATE_DRIVER_INVERTER --> Q_C_LOW MAIN_MCU --> DISTRIBUTION_CTRL["Distribution Controller"] DISTRIBUTION_CTRL --> SW_SENSORS DISTRIBUTION_CTRL --> SW_COMPUTING DISTRIBUTION_CTRL --> SW_COMMS DISTRIBUTION_CTRL --> SW_LIGHTING subgraph "Monitoring & Protection" CURRENT_SENSE["Current Sensors"] --> MAIN_MCU VOLTAGE_SENSE["Voltage Sensors"] --> MAIN_MCU TEMP_SENSE["Temperature Sensors"] --> MAIN_MCU DESAT_PROTECTION["DESAT Protection"] --> GATE_DRIVER_INVERTER OVERCURRENT["Overcurrent Protection"] --> MAIN_MCU OVERTEMP["Overtemperature Protection"] --> MAIN_MCU end end %% Thermal Management subgraph "Tiered Thermal Management" subgraph "Level 1: Liquid/Air Cooling" COOLING_LEVEL1["Liquid Cold Plate/Forced Air"] --> Q_A_HIGH COOLING_LEVEL1 --> Q_B_HIGH COOLING_LEVEL1 --> Q_C_HIGH COOLING_LEVEL1 --> Q_A_LOW COOLING_LEVEL1 --> Q_B_LOW COOLING_LEVEL1 --> Q_C_LOW end subgraph "Level 2: Heatsink Cooling" COOLING_LEVEL2["Aluminum Heatsinks"] --> Q_BRAKE COOLING_LEVEL2 --> Q_ESD end subgraph "Level 3: PCB Thermal Management" COOLING_LEVEL3["PCB Copper Pour"] --> SW_SENSORS COOLING_LEVEL3 --> SW_COMPUTING COOLING_LEVEL3 --> SW_COMMS COOLING_LEVEL3 --> SW_LIGHTING end end %% EMC & Protection Circuits subgraph "EMC & Transient Protection" subgraph "Inverter Protection" RC_SNUBBER["RC Snubber Networks"] --> Q_A_HIGH RC_SNUBBER --> Q_B_HIGH RC_SNUBBER --> Q_C_HIGH TVS_DC_LINK["TVS Diodes"] --> DC_BUS LOW_ESR_CAPS["Low-ESR Capacitors"] --> DC_BUS end subgraph "Brake System Protection" SCHOTTKY_DIODE["Schottky Diode"] --> BRAKE_COIL FERITE_BEAD["Ferrite Bead"] --> BRAKE_COIL GATE_TVS["Gate-Source TVS"] --> Q_BRAKE end subgraph "System-Level Protection" LOAD_DUMP_TVS["Load Dump TVS"] --> BATTERY_PACK VARISTORS["Varistors"] --> AUX_BUS EMI_FILTER["EMI Filter"] --> DC_DC_CONVERTER end end %% Style Definitions style Q_A_HIGH fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style SW_SENSORS fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style Q_BRAKE fill:#ffebee,stroke:#f44336,stroke-width:2px style MAIN_MCU fill:#f3e5f5,stroke:#9c27b0,stroke-width:2px

With the rapid advancement of industrial automation and smart logistics, high-end autonomous forklifts have become core equipment for modern warehouse operations. The powertrain, power distribution, and safety control systems, serving as the "muscles, nerves, and reflexes" of the vehicle, provide robust and precise power conversion and switching for key loads such as traction motors, hydraulic pumps, and safety brakes. The selection of power MOSFETs directly determines system efficiency, power density, thermal performance, and operational reliability. Addressing the stringent requirements of autonomous forklifts for high torque, continuous operation, functional safety, and compact integration, this article focuses on scenario-based adaptation to develop a practical and optimized MOSFET selection strategy.
I. Core Selection Principles and Scenario Adaptation Logic
(A) Core Selection Principles: Four-Dimensional Collaborative Adaptation
MOSFET selection requires coordinated adaptation across four dimensions—voltage, loss, package, and reliability—ensuring precise matching with harsh industrial operating conditions:
Sufficient Voltage Margin: For common high-voltage battery buses (e.g., 96V, 144V, 400V), reserve a rated voltage withstand margin of ≥60-100% to handle regenerative braking spikes, load dumps, and transients.
Prioritize Low Loss: Prioritize devices with very low Rds(on) (minimizing conduction loss in high-current paths) and optimized gate charge (Qg), adapting to frequent start-stop cycles and high continuous current, thereby improving energy efficiency and thermal management.
Package Matching for Power & Environment: Choose high-power packages (TO247, TO263) with excellent thermal performance for main inverters. Select compact, robust packages (DFN, TO251) for auxiliary DC-DC or actuator control, balancing power density, thermal dissipation, and vibration resistance.
Reliability & Ruggedness Redundancy: Meet 24/7 durability in harsh environments, focusing on high junction temperature capability (Tj max ≥ 175°C), avalanche energy rating, and strong ESD protection, adapting to the demanding needs of industrial safety and longevity.
(B) Scenario Adaptation Logic: Categorization by Load Type
Divide loads into three core operational scenarios: First, Main Traction & Hydraulic Motor Drive (power core), requiring very high current, efficiency, and ruggedness. Second, Auxiliary System Power Distribution & Control (functional support), requiring intelligent load switching and management for various subsystems. Third, Safety-Critical Function Control (e.g., parking brake, emergency stop), requiring ultra-high reliability, fast response, and fault-isolation capability. This enables precise parameter-to-need matching.
II. Detailed MOSFET Selection Scheme by Scenario
(A) Scenario 1: Main Traction Inverter / High-Power Hydraulic Pump Drive (10kW-30kW) – Power Core Device
Traction motors and hydraulic pumps require handling extremely high continuous and peak currents, demanding highly efficient and rugged switches in bridge configurations.
Recommended Model: VBGP1102 (Single-N, 100V, 180A, TO247)
Parameter Advantages: SGT technology achieves an exceptionally low Rds(on) of 2.4mΩ at 10V. Continuous current rating of 180A (with high peak capability) suits high-current 48V/96V battery systems. TO247 package offers superior thermal resistance (RthJC typically <0.5°C/W) for direct heatsink mounting, essential for managing high power dissipation.
Adaptation Value: Drastically reduces conduction losses in the inverter phase legs. For a 96V/15kW motor phase current (~160A), per-device conduction loss is only about 61W, contributing to high overall inverter efficiency (>98%). Enables high switching frequency for optimal motor control, improving torque response and efficiency.
Selection Notes: Verify system bus voltage (including spikes) and motor peak current. Must be used with a high-performance gate driver IC (≥4A source/sink) and careful PCB layout to minimize parasitic inductance. Adequate forced air or liquid cooling for the heatsink is mandatory.
(B) Scenario 2: Auxiliary System Power Distribution & DC-DC Conversion – Functional Support Device
Auxiliary loads (sensors, computing units, communication modules, lighting) operate at lower voltages (12V/24V) but require distributed, intelligent switching for power sequencing and energy management.
Recommended Model: VBNCB1206 (Single-N, 20V, 95A, TO262)
Parameter Advantages: Very low Rds(on) of 3mΩ at 10V minimizes voltage drop in power distribution paths. High current rating (95A) allows it to serve as a main distribution switch or in synchronous rectification for high-current DC-DC converters. Low gate threshold voltage (Vth) enables direct or easy drive by logic-level signals.
Adaptation Value: Enables smart zoning of power domains, allowing non-critical systems to be powered down, reducing quiescent current. Its low loss is critical for intermediate bus converter (IBC) efficiency, directly extending battery operational time.
Selection Notes: Ensure application voltage is well below 20V rating (e.g., 12V system). Low Vth requires attention to gate noise immunity. A small gate resistor and local decoupling are recommended.
(C) Scenario 3: Safety-Critical Function Control (Electromechanical Brake, Emergency Disconnect) – Safety-Critical Device
Safety systems require failsafe operation. Using P-MOSFETs for high-side switching provides inherent simplicity and reliability for activating brakes or disconnecting loads.
Recommended Model: VBL2101N (Single-P, -100V, -100A, TO263)
Parameter Advantages: Trench technology provides very low Rds(on) of 11mΩ at 10V for a P-channel device. High current rating (-100A) is suitable for directly driving high-current brake coils or contactors. -100V voltage rating provides ample margin for 48V/96V systems.
Adaptation Value: Simplifies high-side drive circuitry compared to using an N-MOSFET with a charge pump. Allows direct control from a safety microcontroller via a simple level-shifter or bipolar transistor, ensuring fast and reliable activation of the parking brake for immediate stopping.
Selection Notes: Confirm the inductive load's current and voltage requirements. A freewheeling diode is mandatory across the brake coil. Gate drive must ensure full enhancement (Vgs ~ -10V) to minimize conduction loss.
III. System-Level Design Implementation Points
(A) Drive Circuit Design: Matching Device Characteristics
VBGP1102: Pair with isolated or high-side gate driver ICs (e.g., ISO585x, UCC5350) capable of high peak current (>4A). Use Kelvin source connection if available. Implement active Miller clamp functionality.
VBNCB1206: Can be driven directly by a microcontroller GPIO with a series gate resistor (e.g., 5Ω). For very fast switching, a dedicated buffer driver is advised.
VBL2101N: Use a PNP/NPN bipolar transistor or a small N-MOSFET as a low-side switch to pull the gate low. Include a pull-up resistor to the source for defined turn-off.
(B) Thermal Management Design: Tiered Heat Dissipation
VBGP1102: Primary thermal focus. Mount on a substantial aluminum heatsink with thermal interface material. Use thermal vias if mounted on PCB. Monitor case temperature directly.
VBNCB1206: Requires a moderate PCB copper area (≥500 mm²) or a small heatsink on the TO262 tab, depending on current.
VBL2101N: Similar to VBNCB1206; ensure good PCB copper pour or a heatsink for continuous high-current operation.
Ensure system airflow (from vehicle movement or fans) passes over critical heatsinks. Consider liquid cooling for very high-power traction inverters.
(C) EMC and Reliability Assurance
EMC Suppression:
VBGP1102 (Inverter): Use low-inductance DC-link capacitors. Implement RC snubbers across each switch or phase output. Shield motor cables.
VBL2101N (Brake Control): Use a Schottky diode in parallel with the freewheeling diode for faster decay. Add a ferrite bead in series with the load.
Implement strict PCB zoning: separate high-power, high-speed, and sensitive analog/digital areas.
Reliability Protection:
Derating Design: Apply conservative derating (e.g., 70-80% of Vds, Id) under worst-case temperature.
Overcurrent/Overtemperature Protection: Implement DESAT detection for VBGP1102. Use current shunt monitors or hall sensors in all high-power paths.
Transient Protection: Place TVS diodes or varistors at battery input terminals for load dump protection. Use gate-source TVS/clamps on all MOSFETs.
IV. Scheme Core Value and Optimization Suggestions
(A) Core Value
Maximized Powertrain Efficiency: Ultra-low Rds(on) devices minimize energy loss in high-current paths, directly extending battery life and operational duration.
Enhanced Functional Safety & Robustness: Dedicated, reliable switching for safety-critical functions meets SIL/PL related requirements, ensuring operational safety.
Optimized Power Density & Reliability: The combination of high-current TO devices and compact packages for auxiliary functions achieves an optimal balance between power handling, thermal performance, and space utilization for dense vehicle electronics.
(B) Optimization Suggestions
Higher Voltage Adaptation: For 400V+ systems, consider VBL17R07 (700V, 7A, Planar) for auxiliary PFC or charger circuits, or VBFB17R11S (700V, 11A, SJ_Multi-EPI) for higher efficiency in similar roles.
Space-Constrained High-Power: For compact inverter designs, VBGQA1204N (200V, 35A, DFN8) offers a high-power-density solution in a small footprint, suitable for lower-power drive axes.
Integration Upgrade: Consider using pre-assembled power modules (IPMs) for the main inverter for highest integration. Use VBL2101N in dual configurations for redundant safety circuits.
Special Scenarios: For extreme environment durability, seek automotive-grade AEC-Q101 qualified versions of selected parts.
Conclusion
Power MOSFET selection is central to achieving high efficiency, robust performance, functional safety, and reliability in autonomous forklift drive and control systems. This scenario-based scheme provides comprehensive technical guidance for R&D through precise load matching and system-level design tailored to industrial vehicle challenges. Future exploration can focus on SiC MOSFETs for the highest voltage/efficiency traction systems and intelligent driver ICs with integrated diagnostics, aiding in the development of next-generation, fully autonomous material handling platforms.

Detailed Topology Diagrams

Main Traction Inverter - 3-Phase Bridge Topology Detail

graph LR subgraph "3-Phase Inverter Bridge" DC_POS["DC+ (96V/144V)"] --> U_HIGH["VBGP1102
High-Side U"] DC_POS --> V_HIGH["VBGP1102
High-Side V"] DC_POS --> W_HIGH["VBGP1102
High-Side W"] U_HIGH --> MOTOR_U["Motor Phase U"] V_HIGH --> MOTOR_V["Motor Phase V"] W_HIGH --> MOTOR_W["Motor Phase W"] MOTOR_U --> U_LOW["VBGP1102
Low-Side U"] MOTOR_V --> V_LOW["VBGP1102
Low-Side V"] MOTOR_W --> W_LOW["VBGP1102
Low-Side W"] U_LOW --> DC_NEG["DC-"] V_LOW --> DC_NEG W_LOW --> DC_NEG end subgraph "Gate Drive & Control" MCU["Main MCU"] --> PWM_GENERATOR["PWM Generator"] PWM_GENERATOR --> GATE_DRIVER["3-Phase Gate Driver IC"] GATE_DRIVER --> U_HIGH GATE_DRIVER --> V_HIGH GATE_DRIVER --> W_HIGH GATE_DRIVER --> U_LOW GATE_DRIVER --> V_LOW GATE_DRIVER --> W_LOW end subgraph "Protection Circuits" DESAT_CIRCUIT["DESAT Detection"] --> GATE_DRIVER CURRENT_SHUNT["Current Shunt"] --> MCU TEMP_SENSOR["Temperature Sensor"] --> MCU RC_SNUBBER["RC Snubber"] --> U_HIGH RC_SNUBBER --> V_HIGH RC_SNUBBER --> W_HIGH end subgraph "Thermal Management" HEATSINK["Aluminum Heatsink"] --> U_HIGH HEATSINK --> V_HIGH HEATSINK --> W_HIGH HEATSINK --> U_LOW HEATSINK --> V_LOW HEATSINK --> W_LOW COOLING_FAN["Cooling Fan"] --> HEATSINK end style U_HIGH fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style U_LOW fill:#e8f5e8,stroke:#4caf50,stroke-width:2px

Auxiliary Power Distribution & DC-DC Conversion Topology Detail

graph LR subgraph "DC-DC Converter Stage" HV_INPUT["High-Voltage Input"] --> BUCK_CONVERTER["Buck Converter"] subgraph "Synchronous Rectification" Q_MAIN["VBNCB1206
Main Switch"] Q_SYNC["VBNCB1206
Synchronous Rectifier"] end BUCK_CONVERTER --> Q_MAIN Q_MAIN --> INDUCTOR["Power Inductor"] INDUCTOR --> OUTPUT_CAP["Output Capacitors"] Q_SYNC --> INDUCTOR OUTPUT_CAP --> AUX_OUTPUT["24V/12V Output"] CONTROLLER["DC-DC Controller"] --> Q_MAIN CONTROLLER --> Q_SYNC end subgraph "Intelligent Power Distribution" AUX_OUTPUT --> DISTRIBUTION_BUS["Distribution Bus"] subgraph "Load Switch Channels" CH1["VBNCB1206
Channel 1 - Sensors"] CH2["VBNCB1206
Channel 2 - Computing"] CH3["VBNCB1206
Channel 3 - Comms"] CH4["VBNCB1206
Channel 4 - Lighting"] end DISTRIBUTION_BUS --> CH1 DISTRIBUTION_BUS --> CH2 DISTRIBUTION_BUS --> CH3 DISTRIBUTION_BUS --> CH4 CH1 --> LOAD1["Sensor Load"] CH2 --> LOAD2["Computing Load"] CH3 --> LOAD3["Communications Load"] CH4 --> LOAD4["Lighting Load"] DIST_CTRL["Distribution Controller"] --> CH1 DIST_CTRL --> CH2 DIST_CTRL --> CH3 DIST_CTRL --> CH4 end subgraph "Power Management & Protection" subgraph "Current Monitoring" SHUNT_RESISTOR["Shunt Resistor"] --> AMPLIFIER["Current Amplifier"] AMPLIFIER --> DIST_CTRL end subgraph "Voltage Monitoring" VOLTAGE_DIVIDER["Voltage Divider"] --> ADC["ADC"] ADC --> DIST_CTRL end subgraph "Fault Protection" OVERCURRENT["Overcurrent Comparator"] --> DIST_CTRL OVERVOLTAGE["Overvoltage Comparator"] --> DIST_CTRL REVERSE_POLARITY["Reverse Polarity Protection"] --> DISTRIBUTION_BUS end end subgraph "Thermal Design" PCB_COPPER["PCB Copper Pour"] --> CH1 PCB_COPPER --> CH2 PCB_COPPER --> CH3 PCB_COPPER --> CH4 HEATSINK_SMALL["Small Heatsink"] --> Q_MAIN HEATSINK_SMALL --> Q_SYNC end style Q_MAIN fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style CH1 fill:#e3f2fd,stroke:#2196f3,stroke-width:2px

Safety-Critical Function Control Topology Detail

graph LR subgraph "Electromechanical Brake Control" subgraph "High-Side P-MOSFET Switch" BRAKE_MCU["Brake Controller"] --> DRIVER_LOGIC["Driver Logic"] DRIVER_LOGIC --> Q_BRAKE["VBL2101N
-100V/-100A"] POWER_SUPPLY["24V Supply"] --> Q_BRAKE Q_BRAKE --> BRAKE_COIL["Brake Coil (Inductive Load)"] BRAKE_COIL --> GROUND["Ground"] end subgraph "Protection Circuits" FREEWHEEL["Freewheeling Diode"] --> BRAKE_COIL SCHOTTKY["Fast Schottky Diode"] --> BRAKE_COIL FERITE["Ferrite Bead"] --> BRAKE_COIL TVS_GATE["Gate-Source TVS"] --> Q_BRAKE end subgraph "Redundancy & Monitoring" REDUNDANT_SWITCH["Redundant Switch"] --> BRAKE_COIL CURRENT_SENSE["Coil Current Sense"] --> BRAKE_MCU COIL_TEMP["Coil Temperature"] --> BRAKE_MCU end end subgraph "Emergency Disconnect System" subgraph "Main Power Disconnect" EMERGENCY_SIGNAL["Emergency Signal"] --> SAFETY_LOGIC["Safety Logic"] SAFETY_LOGIC --> Q_ESD["VBL2101N
-100V/-100A"] MAIN_POWER["Main Power Bus"] --> Q_ESD Q_ESD --> LOAD_SIDE["Load Side"] end subgraph "Secondary Disconnect Path" REDUNDANT_ESD["Redundant ESD Switch"] --> LOAD_SIDE WATCHDOG["Watchdog Timer"] --> SAFETY_LOGIC end subgraph "Status Feedback" DISCONNECT_STATUS["Disconnect Status"] --> SAFETY_LOGIC CURRENT_MONITOR["Current Monitor"] --> SAFETY_LOGIC end end subgraph "Thermal Management" subgraph "Brake Switch Cooling" BRAKE_HEATSINK["Heatsink"] --> Q_BRAKE AIRFLOW["System Airflow"] --> BRAKE_HEATSINK end subgraph "ESD Switch Cooling" ESD_HEATSINK["Heatsink"] --> Q_ESD ESD_HEATSINK --> AIRFLOW end subgraph "PCB Thermal Design" THERMAL_VIAS["Thermal Vias"] --> Q_BRAKE COPPER_AREA["Copper Area"] --> Q_ESD end end style Q_BRAKE fill:#ffebee,stroke:#f44336,stroke-width:2px style Q_ESD fill:#ffebee,stroke:#f44336,stroke-width:2px
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