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High-Efficiency Motor Drive and Intelligent Power Management Solution for High-End Collaborative Robot Leasing Services – Design Guide Based on Performance-Oriented Power Device Selection
Collaborative Robot Power System Topology Diagram

High-End Collaborative Robot Power System Overall Topology

graph LR %% Power Distribution Architecture subgraph "Main Power Distribution & Motor Drives" MAIN_POWER["Main Power Input
24V/48V DC"] --> DIST_BUS["Distribution Bus"] DIST_BUS --> JOINT_DRIVES["Joint Motor Drives"] DIST_BUS --> AUX_POWER["Auxiliary Power Rails"] subgraph "High-Current Joint Motor Drive Array" MOTOR1["Joint 1 Motor
48V, >100A Peak"] MOTOR2["Joint 2 Motor
48V, >100A Peak"] MOTOR3["Joint 3 Motor
48V, >100A Peak"] MOTOR4["Joint 4 Motor
48V, >100A Peak"] end JOINT_DRIVES --> MOTOR1 JOINT_DRIVES --> MOTOR2 JOINT_DRIVES --> MOTOR3 JOINT_DRIVES --> MOTOR4 subgraph "Motor Drive Power MOSFETs" Q_JOINT1["VBGE1805
80V/120A"] Q_JOINT2["VBGE1805
80V/120A"] Q_JOINT3["VBGE1805
80V/120A"] Q_JOINT4["VBGE1805
80V/120A"] end JOINT_DRIVES --> Q_JOINT1 JOINT_DRIVES --> Q_JOINT2 JOINT_DRIVES --> Q_JOINT3 JOINT_DRIVES --> Q_JOINT4 Q_JOINT1 --> MOTOR1 Q_JOINT2 --> MOTOR2 Q_JOINT3 --> MOTOR3 Q_JOINT4 --> MOTOR4 end %% Sensor & Communication Power Management subgraph "Sensor & Communication Power Management" AUX_POWER --> SENSOR_POWER["Sensor Power Rails
12V/5V/3.3V"] SENSOR_POWER --> SENSOR_SWITCHES["Power Switches"] subgraph "Sensor Module Power Control" SW_VISION["VBI1101M
Vision Sensor"] SW_LIDAR["VBI1101M
LiDAR Module"] SW_WIFI["VBI1101M
Wireless Module"] SW_IO["VBI1101M
I/O Module"] end SENSOR_SWITCHES --> SW_VISION SENSOR_SWITCHES --> SW_LIDAR SENSOR_SWITCHES --> SW_WIFI SENSOR_SWITCHES --> SW_IO SW_VISION --> VISION_MODULE["Vision Camera"] SW_LIDAR --> LIDAR_MODULE["LiDAR Sensor"] SW_WIFI --> WIFI_MODULE["Wi-Fi/BT"] SW_IO --> IO_MODULE["Digital I/O"] end %% Multi-Channel Load Management subgraph "Multi-Channel Load Switching & Distribution" DIST_BUS --> LOAD_DIST["Load Distribution Board"] subgraph "Intelligent Load Switch Array" SW_EE1["VBA3638
End-Effector 1"] SW_EE2["VBA3638
End-Effector 2"] SW_LIGHT["VBA3638
Lighting Control"] SW_SAFETY["VBA3638
Safety Circuit"] SW_FAN["VBA3638
Cooling Fan"] SW_VALVE["VBA3638
Solenoid Valve"] end LOAD_DIST --> SW_EE1 LOAD_DIST --> SW_EE2 LOAD_DIST --> SW_LIGHT LOAD_DIST --> SW_SAFETY LOAD_DIST --> SW_FAN LOAD_DIST --> SW_VALVE SW_EE1 --> end_EFFECTOR1["Gripper/Tool 1"] SW_EE2 --> end_EFFECTOR2["Gripper/Tool 2"] SW_LIGHT --> LED_LIGHT["LED Lighting"] SW_SAFETY --> SAFETY_MODULE["Safety Interlocks"] SW_FAN --> COOLING_FAN["System Fan"] SW_VALVE --> PNEUMATIC_VALVE["Pneumatic Valve"] end %% Control & Communication System subgraph "Control & Communication Architecture" MAIN_CONTROLLER["Main Robot Controller"] --> DRIVE_CONTROLLER["Motor Drive Controller"] MAIN_CONTROLLER --> IO_CONTROLLER["I/O Controller"] MAIN_CONTROLLER --> COMM_CONTROLLER["Communication Controller"] DRIVE_CONTROLLER --> MOTOR_DRIVERS["Gate Drivers"] MOTOR_DRIVERS --> Q_JOINT1 MOTOR_DRIVERS --> Q_JOINT2 MOTOR_DRIVERS --> Q_JOINT3 MOTOR_DRIVERS --> Q_JOINT4 IO_CONTROLLER --> SENSOR_SWITCHES IO_CONTROLLER --> LOAD_DIST COMM_CONTROLLER --> ETHERNET["Ethernet Port"] COMM_CONTROLLER --> CAN_BUS["CAN Bus"] COMM_CONTROLLER --> RS485["RS-485"] end %% Protection & Thermal Management subgraph "System Protection & Thermal Management" subgraph "Electrical Protection" TVS_ARRAY["TVS Diode Array"] RC_SNUBBER["RC Snubber Circuits"] CURRENT_SENSE["Current Sensors"] OVERVOLTAGE["Overvoltage Protection"] OVERCURRENT["Overcurrent Protection"] end TVS_ARRAY --> DIST_BUS RC_SNUBBER --> Q_JOINT1 CURRENT_SENSE --> MOTOR1 OVERVOLTAGE --> MAIN_POWER OVERCURRENT --> JOINT_DRIVES subgraph "Thermal Management" HEATSINK_JOINT["Heatsink: Joint MOSFETs"] PCB_COPPER["PCB Copper Pour"] THERMAL_SENSOR["Temperature Sensors"] FAN_CONTROL["Fan Speed Control"] end HEATSINK_JOINT --> Q_JOINT1 HEATSINK_JOINT --> Q_JOINT2 PCB_COPPER --> VBI1101M THERMAL_SENSOR --> MAIN_CONTROLLER FAN_CONTROL --> COOLING_FAN end %% Style Definitions style Q_JOINT1 fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style SW_VISION fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style SW_EE1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style MAIN_CONTROLLER fill:#fce4ec,stroke:#e91e63,stroke-width:2px

With the expansion of flexible manufacturing and human-robot collaboration, high-end collaborative robots have become core assets in the leasing service market. Their motion control, power distribution, and safety systems directly determine operational precision, energy efficiency, lease cost, and long-term service reliability. As the core switching components in motor drives and power management circuits, the selection of power devices (MOSFETs/IGBTs) profoundly impacts system efficiency, power density, thermal performance, and lifespan. Addressing the requirements for high dynamic response, compact integration, and 24/7 operational reliability in collaborative robots, this guide proposes a systematic power device selection and implementation solution with a scenario-driven design philosophy.
I. Overall Selection Principles: Performance Density and Reliability Balance
Device selection must balance electrical performance, thermal characteristics, package size, and long-term reliability, moving beyond singular parameter optimization to achieve optimal system-level synergy.
Voltage/Current Margin: Based on common DC bus voltages (24V, 48V, or higher), select devices with a voltage rating margin ≥50% to handle regenerative braking voltage spikes. Current rating should support continuous and peak torque demands, with derating to 60-70% of rated current for continuous operation.
Low Loss Priority: Prioritize low on-resistance (Rds(on)) to minimize conduction loss in motor drives. For switching frequency-sensitive applications, consider devices with low gate charge (Qg) and output capacitance (Coss) to reduce dynamic losses and enable higher PWM frequencies for quieter operation.
Package and Thermal Coordination: Choose packages that offer low thermal resistance and suit power density goals (e.g., TO-247, TO-220 for high power; SMD for compact control boards). Design PCB layouts with adequate copper area and thermal vias for effective heat dissipation.
Ruggedness and Lifespan: For leasing models requiring robust operation across diverse environments, focus on devices with high ESD tolerance, avalanche energy rating, and stable parameters over temperature and time.
II. Scenario-Specific Device Selection Strategies
The core electrical loads in a collaborative robot include joint motor drives, auxiliary sensor/controller power rails, and multi-channel power distribution. Each requires tailored device characteristics.
Scenario 1: High-Current Joint Motor Drive (48V Bus, Peak >100A)
Joint actuators demand high efficiency, excellent thermal performance, and high peak current capability for dynamic motion and torque control.
Recommended Model: VBGE1805 (N-MOS, 80V, 120A, TO-252)
Parameter Advantages:
Utilizes advanced SGT technology, achieving an ultra-low Rds(on) of 4.6 mΩ (@10V), drastically reducing conduction losses.
High continuous current (120A) and high peak capability, suitable for servo drive inverters requiring high torque density.
TO-252 package offers a good balance of power handling and footprint, facilitating efficient PCB thermal design.
Scenario Value:
Enables high-efficiency motor drives (>97%), reducing energy consumption and heat generation, critical for leased asset operational cost.
Supports high switching frequencies for precise current control, contributing to smooth, low-noise robot motion.
Design Notes:
Requires a dedicated high-current gate driver IC with adequate sink/source capability.
Implement meticulous PCB layout with a large power plane and thermal vias under the package.
Scenario 2: Sensor & Communication Module Power Management (12V/24V Rails, <10W)
These low-power but always-on or frequently switched circuits require high integration, low gate drive voltage, and minimal standby loss.
Recommended Model: VBI1101M (N-MOS, 100V, 4.2A, SOT89)
Parameter Advantages:
Low Rds(on) of 102 mΩ (@10V) ensures minimal voltage drop in power path switches.
Low gate threshold voltage (Vth ~1.8V) allows direct drive from 3.3V/5V microcontrollers, simplifying design.
Compact SOT89 package saves board space while providing decent thermal performance via PCB copper.
Scenario Value:
Ideal for host-controlled power switching of vision sensors, LiDAR, or wireless modules, enabling deep sleep modes and reducing overall system standby power.
Can be used in point-of-load DC-DC converter synchronous rectification stages.
Design Notes:
Include a small gate series resistor (e.g., 10-47Ω) to damp ringing.
Ensure proper trace width for the load current to minimize conduction loss.
Scenario 3: Multi-Channel Load Switching & Power Distribution
For distributed control of end-effectors, lights, or safety circuits, integrated multi-channel switches save space and simplify control logic.
Recommended Model: VBA3638 (Dual N-MOS, 60V, 7A per channel, SOP8)
Parameter Advantages:
Integrates two low-Rds(on) (28 mΩ @10V) N-channel MOSFETs in one package.
Low Vth (1.7V) compatible with logic-level control.
SOP8 package offers significant space savings compared to two discrete MOSFETs.
Scenario Value:
Enables compact, centralized control of multiple auxiliary loads or safety-rated output channels.
Independent channel control facilitates intelligent power sequencing and fault isolation.
Design Notes:
Can be configured for high-side or low-side switching based on system architecture.
For high-side use, employ a simple charge pump or dedicated high-side driver.
III. Key Implementation Points for System Design
Drive Circuit Optimization:
For VBGE1805, use a robust gate driver (≥2A peak) with proper turn-on/off speed control to balance loss and EMI.
For logic-level MOSFETs (VBI1101M, VBA3638), ensure MCU GPIO can provide sufficient gate current; series resistors are recommended.
Thermal Management Design:
Employ a tiered strategy: VBGE1805 on a dedicated power board with possible heatsink attachment; VBI1101M and VBA3638 rely on PCB copper pours.
Monitor junction temperature via estimators or sensors, especially for joint drives under continuous high-torque operation.
EMC and Reliability Enhancement:
Use RC snubbers or small TVS diodes across MOSFET drains and sources in motor drives to clamp voltage spikes from cable inductance.
Implement comprehensive protection: overcurrent detection, desaturation detection for IGBTs/MOSFETs in drives, and TVS diodes on all external interfaces.
IV. Solution Value and Expansion Recommendations
Core Value:
High Performance & Efficiency: The combination of ultra-low Rds(on) VBGE1805 and efficient switching minimizes energy waste, extending operational time per charge for battery-backed units and reducing electricity costs.
Enhanced Integration & Reliability: The use of integrated multi-channel switches (VBA3638) and logic-level devices (VBI1101M) reduces component count, increases reliability, and supports more compact control electronics.
Leasing-Service Optimized: The focus on ruggedness, thermal performance, and long-term parameter stability aligns with the need for low maintenance and high uptime in rental fleets.
Optimization Recommendations:
Higher Power: For robots with >1kW joint motors, consider higher voltage/current devices in TO-247 packages or parallel configurations of VBGE1805.
Advanced Integration: For ultimate space savings, explore multi-channel driver ICs with integrated MOSFETs (Intelligent Power Stages).
Functional Safety: For safety-critical power isolation, incorporate high-side switches with diagnostic feedback (e.g., PROFET™ style devices) in addition to basic MOSFETs.
Regenerative Braking: For efficient brake energy management, design the DC bus capacitor bank and braking circuit using high-voltage MOSFETs like VBE17R07S if the bus exceeds 48V.
Conclusion
Strategic selection of power semiconductors is fundamental to achieving the high efficiency, compact design, and unwavering reliability demanded by high-end collaborative robots in leasing service models. The scenario-based approach outlined here provides a roadmap for optimizing motor drive and power management subsystems. As robot capabilities evolve, future designs may incorporate wide-bandgap devices (SiC/GaN) for even higher efficiency and power density, further enhancing the value proposition of robot leasing services.

Detailed Topology Diagrams

High-Current Joint Motor Drive Topology Detail

graph LR subgraph "Three-Phase Motor Inverter Bridge" A["48V DC Bus"] --> B["DC Link Capacitors"] B --> C["Inverter Phase Leg U"] B --> D["Inverter Phase Leg V"] B --> E["Inverter Phase Leg W"] subgraph C ["Phase Leg U"] direction TB HIGH_U["VBGE1805
High-Side"] LOW_U["VBGE1805
Low-Side"] end subgraph D ["Phase Leg V"] direction TB HIGH_V["VBGE1805
High-Side"] LOW_V["VBGE1805
Low-Side"] end subgraph E ["Phase Leg W"] direction TB HIGH_W["VBGE1805
High-Side"] LOW_W["VBGE1805
Low-Side"] end C --> F["Phase U Output"] D --> G["Phase V Output"] E --> H["Phase W Output"] F --> I["Joint Motor
Winding U"] G --> J["Joint Motor
Winding V"] H --> K["Joint Motor
Winding V"] end subgraph "Motor Control & Protection" L["Motor Controller
DSP/MCU"] --> M["Gate Driver IC"] M --> HIGH_U M --> LOW_U M --> HIGH_V M --> LOW_V M --> HIGH_W M --> LOW_W N["Current Sensors"] --> L O["Temperature Sensor"] --> L P["Encoder Feedback"] --> L Q["RC Snubber"] --> HIGH_U R["TVS Diode"] --> M end style HIGH_U fill:#e8f5e8,stroke:#4caf50,stroke-width:2px style LOW_U fill:#e8f5e8,stroke:#4caf50,stroke-width:2px

Sensor & Communication Module Power Management Topology

graph LR subgraph "Sensor Power Switching Network" A["12V Auxiliary Rail"] --> B["Input Filter"] B --> C["VBI1101M Power Switch"] C --> D["Output Filter"] D --> E["3.3V LDO Regulator"] E --> F["Sensor Module
Power Input"] G["MCU GPIO
3.3V"] --> H["10-47Ω Gate Resistor"] H --> C I["Current Sense Resistor"] --> J["ADC Input"] J --> G end subgraph "Multiple Sensor Power Channels" subgraph "Vision Sensor Channel" K["VBI1101M
Vision Power"] --> L["Vision Camera
5V/1A"] end subgraph "LiDAR Sensor Channel" M["VBI1101M
LiDAR Power"] --> N["LiDAR Module
5V/2A"] end subgraph "Communication Channel" O["VBI1101M
Wi-Fi Power"] --> P["Wi-Fi Module
3.3V/0.5A"] end subgraph "I/O Channel" Q["VBI1101M
I/O Power"] --> R["Digital I/O
24V/0.1A"] end S["MCU Control Lines"] --> K S --> M S --> O S --> Q end subgraph "Protection & Monitoring" T["TVS Diode"] --> A U["Bypass Capacitor"] --> F V["Thermal Pad"] --> C W["PCB Copper Pour"] --> C end style C fill:#e3f2fd,stroke:#2196f3,stroke-width:2px style K fill:#e3f2fd,stroke:#2196f3,stroke-width:2px

Multi-Channel Load Switch & Power Distribution Topology

graph LR subgraph "VBA3638 Dual-Channel Switch Configuration" A["24V Power Rail"] --> B["Input Protection"] B --> C["VBA3638 Channel 1 Drain"] B --> D["VBA3638 Channel 2 Drain"] E["MCU GPIO"] --> F["Level Shifter"] F --> G["VBA3638 Channel 1 Gate"] F --> H["VBA3638 Channel 2 Gate"] C --> I["Channel 1 Source
To Load 1"] D --> J["Channel 2 Source
To Load 2"] I --> K["Load 1
End-Effector"] J --> L["Load 2
Lighting"] K --> M["Ground"] L --> M end subgraph "Multi-Channel Switch Array" subgraph "Module 1: VBA3638" N1["CH1: Gripper Control"] N2["CH2: Tool Power"] end subgraph "Module 2: VBA3638" O1["CH1: Safety LED"] O2["CH2: Warning Buzzer"] end subgraph "Module 3: VBA3638" P1["CH1: Cooling Fan"] P2["CH2: Pump Control"] end subgraph "Module 4: VBA3638" Q1["CH1: Solenoid 1"] Q2["CH2: Solenoid 2"] end R["MCU I/O Expander"] --> N1 R --> N2 R --> O1 R --> O2 R --> P1 R --> P2 R --> Q1 R --> Q2 S["24V Distribution"] --> N1 S --> N2 S --> O1 S --> O2 S --> P1 S --> P2 S --> Q1 S --> Q2 end subgraph "Diagnostic & Protection" T["Current Sense
per Channel"] --> U["Fault Detection"] V["Thermal Monitoring"] --> U W["TVS Protection"] --> S X["Flyback Diode"] --> K U --> R end style N1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px style O1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px
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