
The global consumer electronics industry is currently experiencing a wave of transformation driven by edge AI hardware. Authoritative data forecasts that global sales of AI glasses will exceed 3.5 million units in 2025 (a 230% year-on-year increase), and the market size is expected to reach 1.4 billion units by 2035, comparable to smartphones. This explosive growth is driven by three core drivers:

Mature technology: The integration of large-scale models (such as Tongyi Qianwen and Wenxin Yiyan) with lightweight AR display solutions enables AI glasses to achieve multimodal interaction and all-weather wearability.
Competition among giants: Leading domestic manufacturers such as Alibaba, Huawei, Xiaomi, Baidu, Tencent, and 360 have been releasing new products intensively. Zhou Hongyi even emphasized at the Internet Conference that "display function is the key to differentiating AI glasses."
Scenario expansion: From office scenarios such as real-time translation and meeting minutes to vertical fields such as sports health monitoring and industrial inspection, AI glasses are becoming the next generation of general-purpose intelligent terminals.
However, the hardware side still faces severe challenges:

Space limitations: The power supply, display, communication and other modules need to be integrated inside the glasses’ legs, and the component thickness needs to be compressed to less than 0.8mm;
Power consumption bottleneck: 7-day standby requires sensor leakage current <0.5μA, and audio THD needs to be <0.05% to ensure voice interaction quality;
High-frequency requirements: Micro OLED drivers must support a 120Hz refresh rate, and Wi-Fi 6E RF control requires a 60% loss reduction.
To address these challenges, VBsemi leverages chip-level packaging and ultra-low power architecture technologies to launch a comprehensive MOSFET product matrix covering the entire AI glasses module, helping manufacturers break through hardware limitations.
Smart Glasses Module Analysis and Recommendations
1. Power management module
Recommended model:
VBQF1306 (30V / 5.2mΩ)
Application scenario: Buck/Boost converter, suitable for main power conversion circuit

Features:
Supports high-frequency switching frequencies up to 1MHz, improving efficiency while reducing inductor size, meeting the needs of lightweight AI glasses.
Gate charge (Qg) as low as 8nC, significantly reducing switching losses
Static power consumption will drop by 37% compared to mainstream products in 2024, extending battery life.
Advantages summary: high performance, high frequency, low power consumption, it is the first choice for main power conversion of AI glasses
VBGQA1602 (60V/2mΩ)
Application scenario: battery protection and charge and discharge management circuit

Features:
Built-in reverse current blocking function to prevent battery backflow and damage to the system
Support over-current and over-voltage protection to improve system reliability
Suitable for Type-C fast charging and wireless charging scenarios
Package advantages: DFN5*6 package, suitable for high power density design
Technical highlights:
VBsemi's DFN8 (3x3) series (such as VBQF1306) is only 0.8mm thick and is suitable for structural designs with limited space inside the temples of glasses.

2. Display driver module
Recommended model:
VBQF1202 (20V/3mΩ)
Application scenario: Micro OLED display driver circuit

Features:
Supports 120Hz refresh rate, latency <15ns, improving visual smoothness
The operating voltage is adapted to 3.3V, meeting the power consumption requirements of silicon-based OLED
Effectively avoid screen ghosting and streaking
Package type: TSSOP, convenient for high-density wiring
VBGQA1602 (60V/2mΩ)
Application scenario: backlight PWM dimming control

Features:
Supports 0.1%~100% stepless dimming to solve the PWM flicker problem
Improve user visual comfort, especially suitable for outdoor strong light environment
Applicable screen types: OLED, LCoS and other display solutions
Scene adaptation suggestions:
If an LCoS solution is used, it is recommended to pair it with VBsemi's VBHM series (high voltage 40V), which supports dynamic aperture adjustment and brightness compensation to enhance image clarity.

3. Sensor and communication module
Recommended model:
VBQA1401 (12V / 0.8mΩ)
Application scenario: sensor load switch control

Features:
Leakage current <0.5μA, significantly extending standby time to more than 7 days
Supports power control of multiple sensors, such as cameras, accelerometers, etc.
Integrated soft start function to prevent power-on shock from damaging the camera module
Applicable chips: Suitable for multi-sensor fusion management requirements in AI glasses
VBGQF1101N (SGT MOSFET/100V)
Application scenario: Wi-Fi 6E/millimeter wave RF power amplifier control

Features:
Switching losses are 60% lower than traditional silicon-based MOSFETs, improving RF module energy efficiency.
Supports high-frequency communication (above 6GHz) to ensure real-time communication and remote control of AI glasses
Advantages Summary: Suitable for high-bandwidth, low-latency wireless communication systems

4. Audio module
Recommended model:
VB1695 (Trench structure/50V)
Application scenario: Bone conduction speaker driver circuit

Features:
THD (Total Harmonic Distortion) <0.05%, ensuring voice command and call quality
Supports 20kHz ultra-high frequency response to meet the needs of high-definition audio transmission
The input capacitance Ciss is only 350pF, which reduces the voice recognition delay.

1. Core power module: at least 6-8 MOSFETs are required
Wireless charging full bridge circuit (4)
Wireless charging uses the principle of electromagnetic induction and requires four MOSFETs to form an H-bridge topology to drive the coil to generate an alternating magnetic field.
Referring to Huawei's 80W Super Wireless Charger design, its wireless charging management module explicitly uses four MOSFETs to control the coil current.
Magnetic contact charge and discharge management (2-4)
The magnetic contacts need to independently control the charging and discharging paths:
Basic solution: Two MOSFETs (one for charge control and one for discharge control), connected back-to-back in series to prevent current backflow.
Enhanced solution: 4 MOSFETs (dual N-channel combination) improve high-current carrying capacity and heat dissipation efficiency, suitable for fast charging scenarios.
Recommended model:
VBGQA1602 (60V/2mΩ)
Application scenario: charging station main power MOSFET

Features:
Supports Type-C and wireless fast charging protocols, and is compatible with mainstream charging standards.
Built-in reverse current blocking function to protect the battery and main control board
System advantages: high efficiency, high reliability, suitable for charging multiple devices at the same time

2. Auxiliary circuit module: about 2-3 MOSFETs
Synchronous step-up/step-down converter (1-2)
To match the eyeglass battery voltage, the charging chamber requires a DC-DC conversion circuit. For example:
The 80W wireless charging synchronous boost module uses two MOSFETs.
Low power scenarios may only require a single MOSFET and an inductor.
Input protection and path management (1)
Used for input overvoltage/overcurrent protection of the USB-C interface, usually equipped with a MOSFET as a switch.
VBQF1306 (30V / 5.2mΩ)
Application scenario: Charging station power management DC-DC converter

Features:
High-frequency switching design reduces inductor size and saves space
Applicable to multi-channel power management solutions inside charging chambers
Package advantage: DFN3x3 small package, suitable for charging chamber compact structure
Recommended Power Management Module Models: VBQF1306, VBGQA1602 Main Features: High Efficiency, Low Power Consumption, High Frequency, Integrated Protection
Recommended display driver modules: VBQF1202, VBGQA1602. Key features: Low latency, support for high refresh rates, and flicker-free dimming.
Recommended sensor/communication module models: VBQA1401, VBGQF1101N. Key features: low leakage current, high frequency, and low loss.
Recommended audio driver module model: VB1695 Main features: low distortion, high fidelity, low latency
Recommended charging silo modules: VBGQA1602, VBQF1306. Features: Fast charging, wireless charging, integrated protection.

As AI glasses become a core end-device in the competitive landscape of major internet manufacturers, the requirements for hardware design sophistication and integration are increasing. VBsemi, leveraging its extensive experience in power MOSFETs, offers a range of high-performance, highly integrated products suitable for various functional modules in AI glasses, helping manufacturers create the next generation of AI wearable devices that are thinner, smarter, and more efficient.
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